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Micro-roughened electrolytic copper foil and copper-clad substrate using the same

A technology of electrolytic copper foil and copper-clad substrate, which is applied in the secondary treatment of printed circuits, the improvement of metal adhesion of insulating substrates, printed circuits, etc. Back-end product yield and other issues to achieve the effect of reducing transmission loss

Active Publication Date: 2021-11-02
CO TECH DEV CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, while reducing the roughness, it will also lead to a decline in the peel strength between the copper foil and the substrate, which will affect the yield of the back-end products.

Method used

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  • Micro-roughened electrolytic copper foil and copper-clad substrate using the same
  • Micro-roughened electrolytic copper foil and copper-clad substrate using the same
  • Micro-roughened electrolytic copper foil and copper-clad substrate using the same

Examples

Experimental program
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Effect test

Embodiment 1

[0040] see Figure 4 and cooperate Figure 5 As shown, the micro-roughened surface 10 of the micro-roughened electrolytic copper foil 1 is formed by using a continuous electrolytic device 3 . The continuous electrolysis device 3 comprises a feeding roller 31, a receiving roller 32, a plurality of electrolytic cells 33 arranged between the feeding roller 31 and the receiving roller 32, a plurality of electrolytic roller groups 34 respectively arranged on the electrolytic cell 33 top and A plurality of auxiliary roller sets 35 are respectively arranged in the electrolytic tank 33 . Wherein, each electrolytic cell 33 is provided with a group of electrodes 331 (such as platinum electrodes), each electrolytic roller group 34 includes two electrolytic rollers 341, and each auxiliary roller group 35 includes two auxiliary rollers 351, and each electrolytic cell 33 The inner electrodes 231 are electrically connected with the corresponding electrolytic roller set 34 to an external po...

Embodiment 2 and 3

[0046] The composition of the base foil, electrolytic device and copper-containing electrolyte is the same as that of Example 1, and the operating conditions are shown in Table 1. The base foil is electrolytically roughened at a production speed of 10 m / min. A piece of electrolytic copper foil 1 subjected to micro-roughening treatment was taken to measure its Sa value and Spd value. The method used was the same as in Example 1, and the results are listed in Table 2. In addition, two pieces of electrolytic copper foil 1 subjected to micro-roughening treatment were bonded to one substrate 2 (low-loss prepreg material, model S7439G) to form a copper-clad substrate L, and then its peel strength was measured. The method and implementation Example 1 is the same, and the results are listed in Table 2.

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Abstract

The invention discloses an electrolytic copper foil subjected to micro-roughening treatment and a copper-clad substrate using the same. The electrolytic copper foil has a micro-rough surface, and the micro-rough surface has a plurality of mountain-shaped structures and a plurality of concave structures corresponding to the mountain-shaped structures. Wherein according to the international standard ISO25178, the product (Sa×Spd) of the arithmetic mean height (Sa) and the vertex density (Spd) of the multiple mountain-shaped structures measured according to the international standard ISO25178 is 150000 to 400000 μm / mm2, and according to the Japanese Industrial Standard JIS B0601- The arithmetic mean waviness (Wa) of multiple mountain-shaped structures measured in 2001 is greater than 0.06 microns and less than or equal to 1.5 microns. In this way, the electrolytic copper foil can achieve both bonding strength and electrical performance.

Description

technical field [0001] The invention relates to an electrolytic copper foil and its application, in particular to a micro-roughened electrolytic copper foil and a copper-clad substrate using the same. Background technique [0002] With the development of information and electronics industry, high-frequency and high-speed signal transmission has become a part of modern circuit design and manufacture. In order to meet the high-frequency and high-speed signal transmission requirements of electronic products, the copper foil substrate used must have good insertion loss performance at high frequencies to prevent excessive loss during high-frequency signal transmission. The insertion loss of copper clad substrate is highly related to its surface roughness. When the surface roughness is reduced, the insertion loss has a better performance, and vice versa. However, while reducing the roughness, it will also lead to a decrease in the peel strength between the copper foil and the su...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/09H05K3/38
CPCH05K1/09H05K3/382
Inventor 宋云兴
Owner CO TECH DEV CORP
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