Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Alloy palladium coated bonding material

A technology of bonding materials and alloys, which is applied in the direction of metal material coating process, coating, sputtering plating, etc., can solve the problems of low ductility, poor comprehensive physical and chemical properties, and inability to guarantee the integrity of the coating, etc., to achieve Excellent physical and chemical properties, good final plastic deformation ability, low cost effect

Inactive Publication Date: 2020-05-19
深圳金斯达应用材料有限公司
View PDF4 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the subsequent pressure processing process, the integrity of the coating cannot be guaranteed, the ductility is not high, and the comprehensive physical and chemical properties are not superior

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] An alloy palladium coating bonding material, including a main core material and a palladium layer formed by plating on the main core material. The main core material is added with trace metals to improve the elongation performance, and the main core material is stretched into an alloy after single crystal melting The core wire is coated with palladium on the surface and then ultra-fine stretched into a bonding wire. The trace metals that improve the elongation performance and the weight percentages per million (parts per million, abbreviated as ppm) of the main core material are as follows : Calcium: 1ppm; Magnesium: 1ppm; Zinc: 2ppm; Tin: 0.5ppm.

[0019] The main core material is copper wire or aluminum wire.

[0020] The purity of the main core material copper wire / aluminum wire is not less than 99.999%.

[0021] The palladium layer formed by the plating is a palladium layer formed by dynamic continuous magnetron sputtering vacuum coating in a vacuum coating device....

Embodiment 2

[0026] An alloy palladium coating bonding material, including a main core material and a palladium layer formed by plating on the main core material. The main core material is added with trace metals to improve the elongation performance, and the main core material is stretched into an alloy after single crystal melting The core wire is coated with palladium on the surface and then ultra-fine stretched into a bonding wire. The trace metals that improve the elongation performance and the weight percentages per million (parts per million, abbreviated as ppm) of the main core material are as follows Calcium: 2ppm; Magnesium: 1.5ppm; Zinc: 2.5ppm; Tin: 2ppm.

[0027] The main core material is copper wire or aluminum wire.

[0028] The purity of the main core material copper wire / aluminum wire is not less than 99.999%.

[0029] The palladium layer formed by the plating is a palladium layer formed by dynamic continuous magnetron sputtering vacuum coating in a vacuum coating device....

Embodiment 3

[0034] An alloy palladium coating bonding material, including a main core material and a palladium layer formed by plating on the main core material. The main core material is added with trace metals to improve the elongation performance, and the main core material is stretched into an alloy after single crystal melting The core wire is coated with palladium on the surface and then ultra-fine stretched into a bonding wire. The trace metals that improve the elongation performance and the weight percentages per million (parts per million, abbreviated as ppm) of the main core material are as follows Calcium: 3ppm; Magnesium: 2ppm; Zinc: 3ppm; Tin: 1.5ppm.

[0035] The main core material is copper wire or aluminum wire.

[0036] The purity of the main core material copper wire / aluminum wire is not less than 99.999%.

[0037] The palladium layer formed by the plating is a palladium layer formed by dynamic continuous magnetron sputtering vacuum coating in a vacuum coating device. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses an alloy palladium coated bonding material, which comprises a main core material, and a palladium layer formed on the main core material in a plating manner; trace metal for improving the extension performance is added into the main core material, the main core material is subjected to single crystal smelting and stretching to form an alloy core wire, palladium is plated onthe surface of the alloy core wire, then the alloy core wire is subjected to superfine stretching to form a bonding wire; and the trace metal for improving the extension performance and the main corematerial have the following weight parts per million (abbreviation is ppm): 1-3 ppm of calcium; 1-2 ppm of magnesium; 2-3 ppm of zinc; and 0.5-1.5 ppm of tin. Compared with the prior art, the beneficial effects of the invention are that: the alloy palladium coated bonding material provided by the invention is easy to prepare, low in cost, excellent in physical and chemical properties and relatively good in ductility, the integrity of a plating layer is effectively ensured in a pressure processing process, and the alloy palladium coated bonding material has relatively good final plastic deformation capacity without intermediate annealing in a subsequent ultrafine stretching process and is worthy of popularization.

Description

technical field [0001] The invention relates to a bonding material, in particular to an alloy palladium coating bonding material. Background technique [0002] Bonding is a technology in which two pieces of homogeneous or heterogeneous semiconductor materials with clean surfaces and atomic level flatness are directly bonded under certain conditions after surface cleaning and activation treatment, and the wafers are bonded into one through van der Waals force, molecular force or even atomic force. [0003] Chinese patent CN100359657C announced a "bonding wire and an integrated circuit device using the same". A dissimilar metal layer of metal and a cladding layer comprising an oxidation-resistant metal having a melting point higher than that of copper and formed on the dissimilar metal layer. The bonding wire can be formed into a ball having a true round shape over a wide range of ball diameters, and can be fabricated using plating techniques without degrading the plating sol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/485C23C14/35C23C14/16
CPCC23C14/165C23C14/35H01L24/05H01L2224/05147H01L2224/05264
Inventor 田鹏
Owner 深圳金斯达应用材料有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com