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Ultraviolet light and moisture dual-curing polyurethane hot melt adhesive and preparation method thereof

A polyurethane hot-melt adhesive, dual-curing technology, applied in the direction of polyurea/polyurethane adhesives, adhesives, adhesive types, etc., can solve the problems of slow rise of cohesion, low initial tack, and increased manufacturing costs, etc. To achieve the effect of rapid increase in speed, high adhesion, and improved functionality

Active Publication Date: 2020-05-08
COLLTECH DONGGUAN BONDING TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the viscosity requirements of the sizing process, the common moisture-curing polyurethane hot melt adhesives in the market cannot use a large amount of high-molecular-weight thermoplastic resins, resulting in low initial adhesion, and its curing speed is limited by the moisture absorption speed and isocyanate groups. The reaction speed of the mass and moisture leads to a large dependence on the humidity and temperature of the environment, and the adhesion force rises slowly. In precision assembly, it generally takes a holding time of 1 to 8 hours to ensure that the bonded sample Yield rate of parts
The pressure holding process not only consumes manual space and reduces production efficiency, but also occupies a large number of pressure holding fixtures, increasing manufacturing costs

Method used

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  • Ultraviolet light and moisture dual-curing polyurethane hot melt adhesive and preparation method thereof
  • Ultraviolet light and moisture dual-curing polyurethane hot melt adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] A preparation method of UV pressure-sensitive / moisture dual-cure polyurethane hot-melt adhesive, the steps are as follows:

[0026] (1) Put 20 parts of thermoplastic EVA resin, 30 parts of polybutylene adipate diol with a molecular weight of 2000, 20 parts of PPG with a molecular weight of 1000, and 1 part of trimethylolethane at 95 ° C and -0.1 MPa vacuum conditions , stirring and dehydrating at 300r / min for 2hrs.

[0027] (2) Lower the temperature of the dehydration mixture in step (1) to 80°C, add 5 parts of hydroxyethyl acrylate monomer, 20 parts of polyisocyanate, and 0.5 parts of dibutyltin dilaurate, and stir the reaction under nitrogen atmosphere 2hrs, get the prepolymer;

[0028] (3) Add 2 parts of TPO photoinitiator, 1 part of A1160, 0.4 parts of BYK 066N to the prepolymer, and stir and defoam under the vacuum state of -0.1MPa to obtain a polyurethane hot melt with UV / moisture dual curing glue.

Embodiment 2

[0030] A preparation method of UV pressure-sensitive / moisture dual-cure polyurethane hot-melt adhesive, the steps are as follows:

[0031] (1) 30 parts of thermoplastic acrylic resin, 30 parts of polypentylene adipate diol with a molecular weight of 2000, 30 parts of PPG with a molecular weight of 1000, and 2 parts of trimethylolpropane at 95 ° C and -0.1 MPa vacuum conditions, Stir and dehydrate at 300r / min for 2hrs.

[0032] (2) Cool down the dehydration mixture in step (1) to 80°C, add 7 parts of hydroxyethyl methacrylate monomer, 20 parts of HDI, 0.5 parts of stannous octoate, and stir for 2 hrs under nitrogen atmosphere , to obtain the prepolymer;

[0033] (3) Add 3 parts of TPO photoinitiator, 1 part of KH580, 0.6 parts of BYK 1790 to the prepolymer, stir and defoam under the vacuum state of -0.1MPa to obtain a polyurethane hot melt with UV / moisture dual curing glue.

Embodiment 3

[0035] A preparation method of UV pressure-sensitive / moisture dual-cure polyurethane hot-melt adhesive, the steps are as follows:

[0036] (1) 40 parts of thermoplastic TPU resin, 30 parts of polyhexamethylene adipate diol with a molecular weight of 2000, 35 parts of PPG with a molecular weight of 1000, and 3 parts of glycerol were placed at 95°C and -0.1MPa under vacuum conditions at 300r / min stirring dehydration 2hrs.

[0037] (2) Cool down the dehydration mixture in step (1) to 80°C, add 9 parts of hydroxypropyl acrylate monomer, 20 parts of MDI, 0.5 parts of dibutyltin dilaurate, and stir for 2hrs under nitrogen atmosphere , to obtain the prepolymer.

[0038] (3) Add 4 parts of 184 photoinitiator, 1 part of KH580, 0.2 parts of BYK A535 to the prepolymer in a vacuum state of -0.1MPa, stir and defoam to obtain a polyurethane hot melt with UV / moisture dual curing glue.

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Abstract

The invention relates to the field of hot melt adhesives, in particular to an ultraviolet light and moisture dual-curing hot melt adhesive and a preparation method thereof. The ultraviolet light and moisture dual-cured polyurethane hot melt adhesive is prepared from the following raw materials in parts by weight: 20 to 50 parts of thermoplastic resin, 20 to 50 parts of polyester polyol, 5 to 35 parts of polyether polyol, 1 to 10 parts of trifunctional small molecular polyol, 1 to 10 parts of hydroxyl-terminated acrylate or amino-terminated vinyl monomer, 2 to 20 parts of polyisocyanate, 0.1 to 1 part of catalyst, 1 to 5 parts of photoinitiator, 0.2 to 2 parts of silane coupling agent and 0.2 to 2 parts of defoaming agent. The polyurethane hot melt adhesive containing double reaction groups of vinyl and isocyanate is prepared by reacting a vinyl functional monomer containing terminal hydroxyl or amino, polyester and polyether polyol with polyisocyanate. After the hot melt adhesive is applied, the molecular weight of the vinyl polymer in the product is further increased through ultraviolet irradiation to form a large-molecular-weight reticular high polymer to generate pressure sensitivity and better initial adhesion strength, so that the functions of quick positioning and no pressure maintaining are achieved.

Description

technical field [0001] The invention relates to the field of hot-melt adhesives, in particular to a dual-curing hot-melt adhesive with ultraviolet light and moisture and a preparation method thereof. Background technique [0002] Moisture-curing polyurethane hot-melt adhesives are widely used in the electronic assembly industry due to their simple curing method, fast positioning speed and easy rework, such as bonding mobile phone frames to TP screens, bonding middle frames to decorative parts, and smart bracelet covers Sealing and waterproof bonding of plate glass and watch case, bonding of vehicle central control screen and support frame, etc. [0003] Due to the viscosity requirements of the sizing process, the common moisture-curing polyurethane hot melt adhesives in the market cannot use a large amount of high-molecular-weight thermoplastic resins, resulting in low initial adhesion, and its curing speed is limited by the moisture absorption speed and isocyanate groups. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C08G18/67C08G18/66C08G18/42C08G18/48C08G18/62C08G18/32
CPCC08G18/3206C08G18/4063C08G18/4238C08G18/48C08G18/6204C08G18/6216C08G18/6611C08G18/672C09J175/14
Inventor 李文俊黄成生
Owner COLLTECH DONGGUAN BONDING TECH CO LTD
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