Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Manufacturing process of flexible circuit board

A flexible circuit board and manufacturing process technology, applied in the direction of printed circuit manufacturing, flexible printed circuit board, printed circuit making wiring diagram, etc., can solve the problems of complex manufacturing process, low production efficiency, complicated circuit board manufacturing process, etc. The effect of simplifying the production process, improving production efficiency and reducing manufacturing costs

Inactive Publication Date: 2020-05-08
DONGGUAN HIROCA AUTOMOTIVE TRIM TECH CO LTD
View PDF4 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The circuit board is one of the basic accessories of various electronic devices. The manufacturing process of the circuit board in the prior art is complicated, and many processes such as copper sinking and etching are required, resulting in high manufacturing costs of the circuit board and low production efficiency; In addition, due to the complicated manufacturing process of circuit boards in the prior art, it is difficult to control the manufacturing process of circuit boards, and the defective rate of circuit boards is relatively high.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing process of flexible circuit board
  • Manufacturing process of flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the embodiments and accompanying drawings, and the contents mentioned in the implementation modes are not intended to limit the present invention.

[0025] see figure 1 As shown, a manufacturing process of a flexible circuit board of the present invention includes the following steps:

[0026] Provide film parts, film parts are prior art, film parts are often used in the field of automotive decoration, also known as automotive film, film parts are made of insulating materials, the thickness of the film parts can be 0.1-10mm.

[0027] Provide conductive ink and screen printing equipment, use screen printing equipment to print conductive ink on one side of the film to form a conductive line, use screen printing equipment for screen printing process is mature, for example, often need in the prior art Screen printing jobs are perfo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to the technical field of flexible circuit board production, and particularly discloses a manufacturing process of a flexible circuit board. The process comprises the following steps that an adhesive film part is provided; conductive ink and silk-screen printing equipment are provided, wherein the conductive ink is printed on one side of the adhesive film part by using the silk-screen printing equipment to form a conductive circuit; and an injection mold is provided, wherein a plastic part is formed on the adhesive film part in an injection molding mode by using the injection mold, the conductive circuit formed by printing the conductive ink on the adhesive film part is clamped between the adhesive film part and the plastic part, and the adhesive film part, the conductive ink and the plastic part are combined to form the flexible circuit board. Processes of electroless plating copper, etching and the like of a flexible circuit board in the prior art are cancelled,so that a production process flow of the flexible circuit board is greatly simplified, the production of the flexible circuit board is simpler and more controllable, the production efficiency of theflexible circuit board is improved, and the manufacturing cost of the flexible circuit board is reduced.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board production, and in particular discloses a manufacturing process of a flexible circuit board. Background technique [0002] The circuit board is one of the basic accessories of various electronic devices. The manufacturing process of the circuit board in the prior art is complicated, and many processes such as copper sinking and etching are required, resulting in high manufacturing costs of the circuit board and low production efficiency; In addition, due to the complicated manufacturing process of the circuit board in the prior art, it is difficult to control the manufacturing process of the circuit board, and the defect rate of the circuit board is relatively high. Contents of the invention [0003] In order to overcome the shortcomings and deficiencies in the prior art, the purpose of the present invention is to provide a manufacturing process for flexible circuit boards, cancel...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/14H05K3/00B29L31/34
CPCB29C45/1418B29C2045/14237B29L2031/3425H05K3/0002H05K3/0014H05K2201/05
Inventor 庄吴钏李叔明
Owner DONGGUAN HIROCA AUTOMOTIVE TRIM TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com