High-resolution solder resist ink

A solder resist ink and high-resolution technology, which is applied in the field of solder resist ink, can solve the problems of lower resolution, low refractive index of photoresist, and low refractive index of solder resist ink, so as to improve resolution, increase refractive index, reduce photosensitive effect

Inactive Publication Date: 2020-05-05
WUXI DERBELL PHTO ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the process of realizing the present invention, the inventors found that the solder resist ink in the prior art has a low refractive index, which leads to at least the following problems:
[0005] The photoresist in the prior art has a low refractive index, and PCB solder mask exposure machines mostly use astigmatism light sources for exposure, so UV light will be refracted at the solder mask ink interface, the lower the refractive index, the larger the refraction angle, resulting in non-exposed areas Sensitive to light, resulting in burrs and reduced resolution

Method used

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  • High-resolution solder resist ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A high-resolution solder mask ink, which is prepared by mixing and stirring the components in the following mass ratios:

[0023] 27 parts of o-cresol epoxy acrylate resin, 25 parts of high refractive index inorganic filler, 8 parts of high refractive index light curing monomer, 2-methyl-1-(4-methylthiophenyl)-2-morpholine -1-acetone photoinitiator 3 parts, 2-isopropylthioxanthone photoinitiator 2 parts, amine curing agent 1 part, epoxy resin 10 parts, 6 parts triglycidyl isocyanurate, 15 parts solvent , 1 part of defoaming agent, 1 part of leveling agent and 1 part of pigment;

[0024] Among them, the high refractive index inorganic filler is rutile with a refractive index of 2.71; the high refractive index light-curing monomer is biphenylmethanol acrylate with a refractive index of 1.60; the amine curing agent is dicyandiamine; the epoxy resin is BPF Type epoxy resin; solvent is dipropylene glycol monomethyl ether; defoamer is Shin-Etsu KS-66 from Shin-Etsu Chemical Co., ...

Embodiment 2

[0026] A high-resolution solder mask ink, which is prepared by mixing and stirring the components in the following mass ratios:

[0027] 45 parts of o-cresol epoxy acrylate resin, 26.5 parts of high refractive index inorganic filler, 5 parts of high refractive index light-curing monomer, 2-methyl-1-(4-methylthiophenyl)-2-morpholine 1.5 parts of -1-acetone photoinitiator, 0.5 parts of 2-isopropylthioxanthone photoinitiator, 0.5 parts of amine curing agent, 5 parts of epoxy resin, 4 parts of triglycidyl isocyanurate, 10 parts of solvent , 1 part of defoaming agent, 0.5 part of leveling agent and 0.5 part of pigment;

[0028] Among them, the high refractive index inorganic filler is anatase, which has a refractive index of 2.55; the high refractive index light-curing monomer is 9,9-bis[4-(2-acryloxyethoxy)phenyl] fluorene bisphenol fluorene It is a diacrylate with a refractive index of 1.61; amine curing agent is melamine; epoxy resin is BPF type epoxy resin; solvent is dipropylene g...

Embodiment 3

[0030] A high-resolution solder mask ink, which is prepared by mixing and stirring the components in the following mass ratios:

[0031] 35 parts of o-cresol epoxy acrylate resin, 30 parts of high refractive index inorganic filler, 6 parts of high refractive index light curing monomer, 2-methyl-1-(4-methylthiophenyl)-2-morpholine -1-acetone photoinitiator 2.25 parts, 2-isopropylthioxanthone photoinitiator 0.75 parts, amine curing agent 1 part, epoxy resin 6 parts, 5 parts triglycidyl isocyanurate, 12 parts solvent , 1 part of defoaming agent, 0.5 part of leveling agent and 0.5 part of pigment;

[0032] Among them, the high refractive index inorganic filler is anatase with a refractive index of 2.55; the high refractive index light-curing monomer is 9,9-bis[4-(2-acryloxyethoxy)phenyl] fluorene bisphenol fluorene It is a diacrylate with a refractive index of 1.61; amine curing agent is melamine; epoxy resin is BPF type epoxy resin; solvent is dipropylene glycol monomethyl ether; def...

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Abstract

The invention relates to high-resolution solder resist ink. The high-resolution solder resist ink is characterized by being prepared from the following components in parts by mass: 25-45 parts of o-cresol formaldehyde epoxy acrylate resin, 25-30 parts of high-refractive-index inorganic filler, 5-8 parts of high-refractive-index photocuring monomer, 2-5 parts of a photoinitiator, 0.5-1.5 parts of an amine curing agent, 5-10 parts of epoxy resin, 4-6 parts of triglycidyl isocyanurate, 10-15 parts of a solvent, 0-3 parts of a defoamer, 0-3 parts of a leveling agent, 0-3 parts of a stabilizer and0-3 parts of a pigment. The high-resolution solder resist ink has the advantages of the large refractive index and the low refraction angle, and can reduce the photosensitivity of the non-exposure area, thereby reducing the burrs and enhancing the resolution.

Description

Technical field [0001] The invention relates to a solder mask ink, in particular to a high resolution solder mask ink. Background technique [0002] Solder mask ink is used for solder mask, protection board and insulation of printed circuit boards. With the development of the electronics industry, printed circuit boards have become thinner and denser. Therefore, the resolution requirements for solder mask inks are getting higher and higher to cope with the production of precision circuit boards. [0003] The prior art solder resist inks are usually configured with ordinary monomers with a refractive index lower than 1.50 and inorganic fillers with a refractive index lower than 2.0, such as patents CN 103788342 and CN100469843. [0004] In the process of implementing the present invention, the inventor found that the solder resist ink in the prior art has a low refractive index, which causes at least the following problems: [0005] The prior art photoresist has a low refractive inde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/03G03F7/004G03F7/027
CPCC09D11/03C09D11/101G03F7/004G03F7/027
Inventor 朱贤红
Owner WUXI DERBELL PHTO ELECTRONICS MATERIAL
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