Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

III-nitride semiconductor avalanche photodetector and preparation method thereof

A nitride semiconductor, avalanche photoelectric technology, applied in the field of photodetectors, can solve the problems of low composite dark current, high reliability and low fringing electric field on the surface of the device, so as to reduce the surface composite dark current, improve the reliability of the device, reduce the The effect of fringing electric fields

Active Publication Date: 2020-03-24
SUN YAT SEN UNIV
View PDF12 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to overcome at least one defect (deficiency) of the above-mentioned prior art, and provides a III-nitride semiconductor avalanche photodetector with a low fringe electric field, which effectively avoids the problem of premature breakdown caused by excessively high fringe electric field of the device , at the same time, the surface compound dark current of the device is low, and the reliability is high

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • III-nitride semiconductor avalanche photodetector and preparation method thereof
  • III-nitride semiconductor avalanche photodetector and preparation method thereof
  • III-nitride semiconductor avalanche photodetector and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as figure 1 As shown, this embodiment provides a III-nitride semiconductor avalanche photodetector, specifically an AlGaN semiconductor avalanche photodetector based on a PIN structure, specifically including: 0.4 μm thick heavily doped n-type Al x Ga 1- x N ohmic contact layer 101, 160nm thick non-intentionally doped Al y Ga 1-y N layer 102 and a p-type layer with a thickness of 100nm; wherein, heavily doped n-type Al x Ga 1-x The Al composition x of the N ohmic contact layer 101 layer=0.6, and the electron concentration is 2×10 18 cm -3 , the unintentionally doped Al y Ga 1-y Al composition y=0.4 of N layer 102, electron concentration is 6×10 16 cm -3 .

[0032] Further, the p-type layer includes p-type Al with higher doping concentration sequentially stacked from top to bottom y Ga 1-y N layer 104, p-type Al with lower doping concentration y Ga 1-y N layer 103, the specific parameters are as follows:

[0033] (1) The n-type Al with low doping con...

Embodiment 2

[0040] Such as image 3 As shown, this embodiment provides a III-nitride semiconductor avalanche photodetector, specifically, an AlGaN semiconductor avalanche photodetector based on a PININ absorption derived from a PIN structure and a multiplication separation structure, including: 0.4 μm thick heavily doped n-type Al x Ga 1-x N ohmic contact layer 301, 0.18 μm thick unintentionally doped Al y Ga 1-y N absorbing layer 302, 60nm thick Al y Ga 1-y N charge layer 303, 130nm thick unintentionally doped Al y Ga 1-y N multiplication layer 304 and a p-type layer with a thickness of 100nm; wherein, the Al composition x=0.6, y=0.4, and the heavily doped n-type Al x Ga 1-x The electron concentration of the N ohmic contact layer 301 is 2×10 18 cm -3 , the unintentionally doped Al y Ga 1-y The electron concentration of the N absorbing layer 302 is 6×10 16 cm -3 , the electron concentration of the charge layer 303 is 1×10 18 cm -3 , the electron concentration of the multip...

Embodiment 3

[0049] Such as Figure 4 As shown, the difference between this embodiment and embodiment 1 is that the p-type Al with higher doping concentration in the p-type layer y Ga 1-y The edge thickness of the N layer 104 is consistent with the thickness in the center of the device.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a III-nitride semiconductor avalanche photodetector and a preparation method thereof. The III-nitride semiconductor avalanche photodetector comprises an active layer, and the active layer sequentially comprises a heavily doped n-type AlxGa1-xN ohmic contact layer, an unintentionally doped AlyGa1-yN and a p-type layer according to a growth sequence from bottom to top. The p-type layer comprises a p-type AlyGa1-yN layer with relatively high doping concentration and a p-type AlyGa1-yN layer with relatively low doping concentration from top to bottom. The p-type AlyGa1-yN layer with the lower doping concentration is of a concave structure with a thin center and a thick edge, and the p-type AlyGa1-yN layer with the higher doping concentration is of a convex structure with a thick center and a thin edge, and the convex structure is matched with the p-type AlyGa1-yN layer with the lower doping concentration. Compared with the prior art, the p-type layer can limit the high electric field in the center of the table-type device, the electric field intensity is reduced at the edge of the table-type structure, the problem of advanced breakdown caused by the too high electric field at the edge is solved, and meanwhile, the effects of reducing the surface recombination current and improving the working reliability of the device are achieved.

Description

technical field [0001] The present invention relates to the technical field of photodetectors, more specifically, to a Group III nitride semiconductor avalanche photodetector and a preparation method thereof. Background technique [0002] Ultraviolet photodetectors based on ternary and trigroup nitride semiconductor AlGaN have attracted widespread attention because they can realize intrinsic visible light blindness (280-400nm) and solar-blind ultraviolet (220-280nm) detection. It has broad application prospects in fields such as detection, flame detection, environmental monitoring and astrophysics. In most ultraviolet detection applications, since the ultraviolet signal is usually very weak, it is required that the ultraviolet photodetector has low dark current, high quantum efficiency and high internal gain. With the advantages of high photocurrent gain, high response speed, and low noise, avalanche photodiodes are one of the most promising device types for high-sensitivit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L31/105H01L31/0304H01L31/18
CPCH01L31/03048H01L31/105H01L31/1848Y02P70/50
Inventor 江灏张震华邱新嘉
Owner SUN YAT SEN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products