A high-efficiency laser direct writing lithography method that can realize long focal depth and small focal spot structure

Abstract

The invention discloses a high-efficiency laser direct writing lithography method capable of realizing a long focal depth and small focal spot structure, phase modulation through DOE can exceed the diffraction limit, and improve the resolution and focal depth of the "light needle"; through optical scanning It can realize the movement of the "light needle" on the photoresist plane, and improve the speed of laser direct writing lithography. The optical scanning system utilizes a 2D galvanometer system to produce a small angular deflection of -10° to +10° in both the X and Y directions. The X-axis vibrating mirror vibrates along the X-axis direction, and the Y-axis vibrating mirror vibrates along the Y-axis direction. After sequentially passing through the scanning lens, tube lens, pure phase binary optical element and high numerical aperture microscopic objective lens, the resolution, focal depth and uniformity of moving along the X-axis and Y-axis near the focal plane are not affected by the angle. A "light needle" for deflecting effects. The resolution, focal depth and direct writing efficiency of laser direct writing lithography are improved.

Description

technical field [0001] The invention belongs to the field of micro-nano processing, and in particular relates to a high-efficiency laser direct writing photolithography method capable of realizing a long focal depth and small focal spot structure. Background technique [0002] Laser direct writing lithography is one of the main technologies for making diffractive optical elements. Compared with traditional mask lithography, laser direct writing lithography has the advantages of no mask, flexible processing, and low requirements on the flatness of the substrate surface. At present, laser direct writing technology is mainly used in integrated circuit manufacturing, material surface treatment and etching, diffractive optical element processing, micro-nano structure device manufacturing and other fields. Improving the resolution and depth of focus of the laser direct writing lithography system has always been the focus of research by researchers. The traditional method to improv...

AI Technical Summary

Problems solved by technology

Improving the resolution and depth of focus of the laser direct writing lithography system has always been the focus of research by researchers. The traditional method to improve the lithography resolution is to shorten the exposure wavelength and increase the numerical aperture of the lithography objective lens, but this method is improving resolution while sharply reducing the depth of focus

In addition, traditional laser direct writing lithography requires the use of a translation stage to achieve mechanical scanning, but the precision of mechanical line displacement is related to the size of the range of motion. The larger the displacement range, the lower the positioning accuracy. In precision laser direct writing equipment , requiring high-speed, high-precision positioning and linkage, but high-speed, large-range motion and high-precision, high-resolution mutual constraints

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