Ultra-thin flat heat pipe liquid-absorbing core and manufacturing method thereof

Abstract

The invention discloses an ultra-thin flat heat pipe type liquid-absorbing core and a manufacturing method thereof. Based on a colloid crystal template method, a physical vapor deposition technology and an electrochemical deposition method, the liquid-absorbing core with micro-nano spherical holes and cylindrical holes is designed. The liquid-absorbing core has the following advantages that 1) theliquid-absorbing core is integrated with the heating surface of a heat pipe, thereby avoiding the contact thermal resistance; 2) the micro-nano holes cooperate, so that the gasification core number and capillary force of the boiling surface are taken into consideration; (3) gas and liquid channels are separated, so that the gas and liquid flow resistance is reduced; (4) the liquid-absorbing corehas the bearing capacity, so that the flat heat pipe does not need additional support; (5) the hole size can be arbitrarily adjusted and the capillary force is provided according to actual requirements, so that the heat pipe runs under the reverse gravity; and the manufacturing method is simple, few in consumables and low in cost. Low-temperature-difference and high-heat-flux-density heat dissipation and cooling in the fields of machinery, electronics, aerospace and the like can be realized in a narrow and small space.

Description

technical field [0001] The invention relates to an ultra-thin flat heat pipe liquid-absorbing core and a manufacturing method thereof, belonging to the technical field of heat transfer Background technique [0002] Nowadays, with the continuous advancement and development of science and technology, the size of electronic equipment is getting smaller and smaller, and the components are becoming more and more compact. As the power consumption of electronic equipment continues to increase, a large amount of heat will be generated when the equipment is running at high power. The accumulation of heat will cause the system to run unstable and damaged. At the same time, the temperature distribution inside the electronic components will be uneven due to the high temperature of the rest Uniform thermal stress leads to thermal deformation. The vast majority of electronic equipment will affect the work efficiency due to insufficient heat dissipation, so how to improve the heat dissipa...

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Problems solved by technology

The liquid-absorbing core structure in the form of powder sintering has strong liquid absorption capacity and high heat transfer efficiency, but due to the mixing of gas-liquid two-phase flow channels, the resistance to gas and liquid flow is increased

At the same time, due to the thinness and small volume of ultra-thin heat pipes, traditional liquid-absorbent cores are difficult to apply to ultra-thin heat pipes. The existing processing technologies such as electronic etching and laser processing are expensive and difficult to achieve large-scale production. and use

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