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Biodegradable polymer composite with high thermal conductivity and preparation method thereof

A technology of biodegradation and composite materials, which is applied in the field of high thermal conductivity biodegradable polymer composite materials and its preparation, can solve the problems such as the decline of mechanical properties of materials, achieve the improvement of mechanical properties, the preparation method is simple and easy, and the glass transition can be improved The effect of temperature

Active Publication Date: 2020-02-04
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, the filler forms an oriented state structure inside the polymer matrix, but permanent deformation occurs when the stretching process promotes the orientation and crystallization of the polymer molecular chain, which fixes the material defects of the polymer during the stretching process, such as The accumulation of fillers or the pores of the material cause the decline of the mechanical properties of the material

Method used

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  • Biodegradable polymer composite with high thermal conductivity and preparation method thereof
  • Biodegradable polymer composite with high thermal conductivity and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] S1: 1g of polypropylene carbonate and 25ml of N-N dimethylformamide are ultrasonically stirred for 2 hours to completely dissolve to obtain dispersion A;

[0034] S2: Disperse 0.4g silicon carbide nanowires in 40ml NN dimethylformamide to obtain a silicon carbide nanowire dispersion with a concentration of 10mg / ml; (mass ratio of the polypropylene carbonate to the thermally conductive nanofiller 100:40)

[0035] S3: Add the silicon carbide nanowire dispersion obtained in step S2 to dispersion A at 2 drops per second, stir for 6 hours to obtain a silicon carbide nanowire-polymer mixture, and add the mixture to deionized water for precipitation To obtain a precipitate, which is washed with deionized water, filtered, dried, and thermoformed to obtain an initial composite material;

[0036] S4: Heat the initial composite material described in step S3 at 100°C for 2 minutes to soften it, and then stretch it to 3 times its initial length and drop to room temperature to fix the temp...

Embodiment 2

[0043] The difference between Embodiment 2 and Embodiment 1 is:

[0044] S1: 1g of polypropylene carbonate and 25ml of tetrahydrofuran were ultrasonically stirred for 2 hours to completely dissolve, and dispersion A was obtained.

[0045] S2: Disperse 0.3 g of silver nanowires in 42 ml of tetrahydrofuran to obtain a silver nanowire dispersion with a concentration of 7 mg / ml. (The mass ratio of the polypropylene carbonate and the thermally conductive nano filler is 100:30)

[0046] S3: Add the silver nanowire dispersion obtained in step S2 to dispersion A at 2 drops per second, stir for 8 hours to obtain a silver nanowire-polymer mixture, and add the mixture to deionized water for precipitation to obtain Precipitation, where the precipitate is washed with deionized water, filtered, dried, and thermoformed to obtain a composite material;

[0047] S4: Heat the composite material described in step S3 at 60°C for 10 minutes to soften it, and then stretch it to twice its original length an...

Embodiment 3

[0052] The difference between Embodiment 3 and Embodiment 1 is:

[0053] S1: 3g of polypropylene carbonate and 30ml of dimethyl carbonate are ultrasonically stirred for 2 hours to completely dissolve, and dispersion A is obtained.

[0054] S2: Disperse 0.15g of boron nitride nanosheets in 37.5ml of dimethyl carbonate to obtain boron nitride nanosheets with a concentration of 4mg / ml. (The mass ratio of the polypropylene carbonate to the boron nitride nanosheet is 100:20)

[0055] S3: Add the boron nitride nanoplatelet dispersion obtained in step S2 dropwise to the dispersion A, stir for 10 hours to obtain a boron nitride nanoplatelet-polymer mixture, and add the mixture to deionized water to precipitate To obtain a precipitate, which is washed with deionized water, filtered, dried, and thermoformed to obtain a composite material;

[0056] S4: The composite material in step S3 is heated at 60°C for 5 minutes to soften, and then stretched to 1.5 times its original length and reduced to ...

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Abstract

The invention discloses a biodegradable polymer composite with high thermal conductivity. The biodegradable polymer composite comprises heat-conducting nanofiller and a biodegradable polymer with a shape memory characteristic, wherein the heat-conducting nanofiller is arranged in the biodegradable polymer in order. The heat-conducting nanofiller without chemical modification is mixed with the biodegradable polymer, by use of the shape memory characteristic of the polymer, the heat-conducting nanofiller is arranged in order by stretch induced self-assembly, meanwhile, the heat-conducting nanofiller arranged in order is used as a physical crosslinking site to maintain the orientation state of the material, after the obtained material is heated secondarily, the filler still keeps high orientation, a constructed orientated structure facilitates lap joint of an ordered filler network with a small quantity of heat-conducting nanofiller, so that the production cost is reduced, the material density is reduced, the strength and ductility of the material are enhanced, and the thermal conductivity of the material is improved.

Description

Technical field [0001] The invention belongs to the technical field of high thermal conductivity composite materials, and more specifically, relates to a high thermal conductivity biodegradable polymer composite material and a preparation method thereof. Background technique [0002] With the rapid development of electronic equipment towards miniaturization and integration, efficient heat dissipation has become the basis for ensuring its normal operation. The reliability of electronic equipment operation deteriorates sharply as its internal temperature rises. The main factor affecting the heat dissipation efficiency of electronic equipment is the heat transfer barrier between the heat source and the radiator. There is a gap between the two solids because they can’t fit tightly. The extremely low thermal conductivity of air (0.023Wm -1 k -1 ) Causes heat to be preferentially conducted between two solids in local contact. On the one hand, the large amount of heat accumulated loca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L69/00C08K7/00C08K3/34C08K3/08C08K3/38C08J7/00C08J3/215
CPCC08J3/215C08J7/08C08J2300/16C08K3/08C08K3/34C08K3/38C08K7/00C08K2003/0806C08K2003/385C08K2201/001C08K2201/011C08L2201/06C08L2201/14C08L2203/206C08L69/00
Inventor 解孝林瞿昊叶昀昇尹亮亮周兴平
Owner HUAZHONG UNIV OF SCI & TECH
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