Photosensitive resin and application of photosensitive resin to preparation of liquid photosensitive solder resist ink

A technology of photosensitive solder resist ink and photosensitive resin, which is applied in the direction of photosensitive materials, inks, and applications for photomechanical equipment, which can solve problems such as pollution, increased PCB production costs, and large emissions of organic volatiles, and achieve reduction Effects of production cost, efficiency improvement and emission reduction

Active Publication Date: 2020-01-10
新东方油墨有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the inks used in PCB production are all organic solvent-based, and the solvent-based photosensitive solder resist ink is one of the larger ones, resulting in large emissions of organic volatile compounds (VOCs), serious pollution, and increased PCB production. Cost of production

Method used

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  • Photosensitive resin and application of photosensitive resin to preparation of liquid photosensitive solder resist ink
  • Photosensitive resin and application of photosensitive resin to preparation of liquid photosensitive solder resist ink

Examples

Experimental program
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Effect test

Embodiment 1

[0018] The preparation method of the photosensitive resin described in this embodiment is: add 235 grams of bisphenol A type epoxy acrylic resin modified by special epoxy resin and 180 grams of diethylene glycol ethyl ether acetate in a three-necked flask, and add 72 grams of acrylic acid, 4 grams of N, N-dimethylbenzylamine, 4 grams of hydroquinone, heated to 100 ° C for 10 hours, then added 90 grams of tetrahydrophthalic anhydride and heated to 110 ° C for 5 hours to obtain A photosensitive resin with an acid value of 63.5 mgKOH / g and a solid content of 68%.

Embodiment 2

[0020] The preparation method of the photosensitive resin described in this embodiment is: add 235 grams of bisphenol A type epoxy acrylic resin modified by special epoxy resin and 185 grams of diethylene glycol ethyl ether acetate in a three-necked flask, and add 72 grams of acrylic acid, 4 grams of N, N-dimethylbenzylamine, 4 grams of hydroquinone, heated to 100 ° C for 10 hours, then added 65 grams of tetrahydrophthalic anhydride and heated to 110 ° C for 5 hours to obtain A photosensitive resin with an acid value of 59 mgKOH / g and a solid content of 68%.

Embodiment 3

[0022] The preparation method of the photosensitive resin described in this embodiment is: add 235 grams of bisphenol A type epoxy acrylic resin modified by special epoxy resin and 190 grams of diethylene glycol ethyl ether acetate into a three-necked flask, and add 72 grams of acrylic acid, 4 grams of N, N-dimethylbenzylamine, 4 grams of hydroquinone, heated to 100 ° C for 10 hours, then added 45 grams of tetrahydrophthalic anhydride and heated to 110 ° C for 5 hours to obtain A photosensitive resin with an acid value of 56.4 mgKOH / g and a solid content of 68%.

[0023] comparison example

[0024] The preparation method of the photosensitive resin described in this comparative example is: add 220 g of silicone-modified novolac epoxy resin and 231.5 g of diethylene glycol monoethyl ether acetate into a three-necked flask and heat it to 70° C. to dissolve, and then add methyl 88g of acrylic acid, 1.5g of N,N-dimethylbenzylamine, 100g of toluene, 1g of concentrated sulfuric aci...

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Abstract

The invention discloses photosensitive resin and application of the photosensitive resin to the preparation of liquid photosensitive solder resist ink. The photosensitive resin is prepared from the following raw materials in parts by weight: 200 to 300 parts of bisphenol A type epoxy acrylic resin; 180 to 190 parts of diethylene glycol monoethyl ether acetate; 45 to 90 parts of acrylic acid; 2 to8 parts of N, N-dimethyl benzylamine; 2 to 8 parts of hydroquinone; and 45 to 90 parts of tetrahydrophthalic anhydride. Matrix resin synthesized from the photosensitive resin has better toughness, more excellent hydrophilicity and more excellent dehydration performance in the production process compared with matrix resin in the prior art. When the photosensitive resin is added into the formula ofthe liquid photosensitive solder resist ink, the discharge amount of VOCs (volatile organic compounds) of the ink is greatly reduced.

Description

technical field [0001] The invention belongs to the technical field of electronic materials and the technical field of polymer material chemical industry, and in particular relates to a photosensitive resin and its application in preparing liquid photosensitive solder resist ink. Background technique [0002] With the development of miniaturization, ultra-thinning and light weight of electronic products, the circuit board (PCB) circuit is now developing towards high concentration, and the production of circuit board (PCB) needs to adopt new technologies and new processes to adapt to these higher density For the requirements of fine pitch and smaller geometric dimensions, one of the key materials is a layer of polymer organic film coated on the substrate to protect the solder resist ink of the circuit board. It will not crack when it is over soldering high temperature. No penetration, no foaming and oil removal during electroless gold plating. [0003] At present, the inks u...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/027C09D11/102
CPCG03F7/004G03F7/027C09D11/102
Inventor 胡仕锬沈杰
Owner 新东方油墨有限公司
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