Application of ion gel in graphene transfer and graphene transistor fabrication, graphene transistor and fabrication method of graphene transistor

An ion gel and graphene technology, applied in the field of graphene, can solve the problems such as the inability of PMMA to be completely cleaned, the effective width of the transistor channel is narrowed, and the performance of the transistor is affected. performance effect

Active Publication Date: 2019-12-20
BEIJING INST OF NANOENERGY & NANOSYST
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1. After the transfer of graphene, PMMA cannot be completely removed, and PMMA residues will form traps on graphene, which will affect the performance of transistors prepared from it;
[0006] 2. PMMA has a small elastic modulus, which makes cracks prone to appear during the transfer process, resulting in narrowing of the effective width of the transistor channel, or even breaking the circuit, which affects the performance of the prepared transistor;
[0007] 3. The process is complicated, the process is long, and the cost is high

Method used

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  • Application of ion gel in graphene transfer and graphene transistor fabrication, graphene transistor and fabrication method of graphene transistor
  • Application of ion gel in graphene transfer and graphene transistor fabrication, graphene transistor and fabrication method of graphene transistor
  • Application of ion gel in graphene transfer and graphene transistor fabrication, graphene transistor and fabrication method of graphene transistor

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preparation example Construction

[0054] In a fourth aspect, the present invention provides a method for preparing a graphene transistor, the method comprising:

[0055] (1) preparing a substrate with a drain and a source, wherein a channel is provided between the drain and the source;

[0056] (2) Transfer the ion gel / graphene layer to the channel according to the graphene transfer method described above, and make the graphene layer contact with the drain electrode and the source electrode respectively , and then initiate the polymerization of polyethylene glycol diacrylate monomer under the condition that the initiator can act, so as to obtain the graphene transistor.

[0057] According to the present invention, the substrate can be a conventional substrate in the art for preparing graphene transistors, for example, it can be formed by crossing a metal layer on a silicon wafer or PET (polyethylene terephthalate). the substrate. Preferably, the substrate has a thickness of 4-6 mm and a length of 1-3 cm.

...

Embodiment 1-3

[0076] For illustrating the preparation method of the graphene transistor provided by the present invention

[0077] (1) Preparation of single-layer graphene by chemical vapor deposition

[0078] Copper foil (10cm×10cm, 25μm, Sigma) was first treated with piranha solution (H 2 SO 4 with H 2 o 2 (with a mixture of 7:3) for 15 minutes. It was then rinsed again by immersion in deionized water, and dried with nitrogen. Then add the cleaned copper foil into the quartz tube exhausted of air, when the internal pressure of the quartz tube reaches 5×10 -3 When Torr, pass H 2 , while heating the quartz tube to 1000°C for 30 minutes, then continuously injecting H 2 (flow velocity 10sccm), feed the CH with a flow velocity of 5sccm 4 gas, making the graphene grow continuously. After 30min, stop feeding CH 4 , the quartz tube at H 2 Cool to room temperature in a stream. Single-layer graphene grown on copper foil was obtained.

[0079] (2) Preparation of gold electrodes

[0080...

Embodiment 4

[0086] This comparative example is used to illustrate the preparation method of the graphene transistor of reference

[0087] The preparation of the graphene transistor is carried out according to the method of Example 1, the difference is that the ionic liquid [EMIM][TFSI] is still used, but the ratio is not according to Example 1. The weight part of ionic liquid is 92%, the weight part of polymer PEGDA is 7%, the weight part of photoinitiator HOMPP is 1%, and the curing of ion gel is not complete.

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Abstract

The invention relates to the technical field of graphene, and discloses application of ion gel in graphene transfer and graphene transistor fabrication, a graphene transistor and a fabrication methodof the graphene transistor. An ion liquid and an initiator are contained in the ion gel, and the ion liquid comprises 1-ethyl-3-methylimidazole-bi (trifluoromethanesulfonic acid) imidazole and a polyethylene glycol diacrylate monomer. By using the ion gel to do graphene transfer, the ion gel is not needed to be removed, capture trap formed by PMMA residue on graphene is solved, the cost is reduced, and a poisonous solvent is prevented from being used; and the ion gel is large in elastic modulus, and a gap is difficult to generate. Moreover, in the graphene transistor fabricated by the method,the ion gel is directly used as a gate dielectric layer, fabrication of the gate dielectric layer is not needed to be independently performed, and the process is simplified; and in the obtained graphene transistor, a threshold voltage and hysteresis both are reduced, the source current is increased under the same gate voltage, and the mobFabrication method of array substrate and array substrateility is improved.

Description

technical field [0001] The invention relates to the technical field of graphene, in particular to the application of ion gel in graphene transfer and preparation of graphene transistors, graphene transistors and preparation methods thereof. Background technique [0002] In recent years, graphene has been favored for its excellent electrical, optical, magnetic and mechanical properties. Among them, the monoatomic layer thickness of single-layer graphene endows it with excellent transparency and flexibility. Therefore, single-layer graphene is widely used in flexible transparent electrodes, transistor semiconductors, radio frequency, sensor active materials, etc. [0003] Graphene is generally grown on a metal substrate by CVD, and it needs to be transferred to the target substrate for transistor fabrication. The transfer method is divided into dry transfer and wet transfer. Dry transfer is costly and difficult, and is rarely used. And wet transfer is more common, at prese...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/10H01L29/16H01L29/423H01L29/78H01L21/336
CPCH01L29/1606H01L29/1033H01L29/42372H01L29/78H01L29/66477
Inventor 孙其君孟艳芳
Owner BEIJING INST OF NANOENERGY & NANOSYST
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