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A polyamide-imide-polyimide copolymer molding compound and its preparation method

A technology of polyamide-imide and polyimide, which is applied in the field of preparation of polyamide-imide-polyimide copolymer wear-resistant self-lubricating molding compound, which can solve the problem of poor toughness of molded products, limited application range, and mold pressing problems. Problems such as high molding conditions, to achieve the effects of improved heat resistance, outstanding mechanical properties, and good processing performance

Active Publication Date: 2022-01-25
CENT SOUTH UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, most aromatic polyimides, especially phenylene-type polyimides, are insoluble and infusible, the molding conditions are high, and the molded products have poor toughness, which limits their application range.

Method used

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  • A polyamide-imide-polyimide copolymer molding compound and its preparation method
  • A polyamide-imide-polyimide copolymer molding compound and its preparation method
  • A polyamide-imide-polyimide copolymer molding compound and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Differential DMAC2748 grams were put into the reactor, 320 g 2, 2'-bis (trifluoromethyl) -4,4-diaminipine was added under nitrogen protection, and all of them were dissolved in the diamine monomer. 260 grams of 4,4'-bisphenol A diethrhydrahydride in batches, high-speed stirring reaction time 24 h, batch of 1,2,4-blenedhenic anhydride 1,2,4-blenediphenylene dianer 1,07.1 grams, control material temperature -10 ~ 10 ° C during the whole process .

[0052] After the incubation was completed, 51.5 g of acidic triethylamine was added, and the dropwise time was controlled at 30 minutes, and the reaction was completed after 18 hours.

[0053] A mixture of 183.6 g of acetic anhydride was added dropwise to 121.2 g of triethylamine, and chemical imidization was carried out at room temperature, and the reaction time was 8 h.

[0054] The polyimide solution was poured into a large amount of water and then filtered, washed, and then filtered. The resin powder was dried in vacuo at 70 ° ...

Embodiment 2

[0057] Diffissed DMAC2640 grams were put into the reactor, adding 352 g of 2,2'-bis (trifluoromethoxy)-biphenylenediamine under nitrogen, and after all of the monomide to be diamine monomer, batch Input 4,4'-phenylene oxodebrene terephthalic anhydride 201 grams, high-speed stirring reaction time 24 h, batch 1,2,4-blenedhenic anhydride 1,2,4-barenenic anhydride 1,27.1 grams, control material temperature -10 ~ 10 ° C during the whole process .

[0058] After the incubation was completed, 51.5 g of acidic triethylamine was added, and the dropwise time was controlled at 30 minutes, and the reaction was completed after 18 hours.

[0059] A mixture of 183.6 g of acetic anhydride was added dropwise to 121.2 g of triethylamine, and chemical imidization was carried out at room temperature, and the reaction time was 8 h.

[0060] The polyimide solution was poured into a large amount of water and then filtered, washed, and then filtered. The resin powder was dried in vacuo at 70 ° C for 12 h...

Embodiment 3

[0063] Differential DMAC2416 grams were put into the reactor, 336 g 2, 2'-bis (trifluoromethyl) -4,4'-diaminophenyl ether was added under nitrogen protection, and all of the monomide to be diamine monomer After dissolving, 3, 3 ', 4,4'-xinophenone tetramethrid dihydride, high-speed stirring reaction time 24 h, batching 1, 2, 4-blenediphenyl aionic anhydride 107.1 grams, control over the process Material temperature - 10 ~ 10 ° C.

[0064] After the incubation was completed, 51.5 g of acidic triethylamine was added, and the dropwise time was controlled at 30 minutes, and the reaction was completed after 12 hours.

[0065] A mixture of 183.6 g of acetic anhydride was added dropwise to 121.2 g of triethylamine, and chemical imidization was carried out at room temperature, and the reaction time was 8 h.

[0066] The polyimide solution was poured into a large amount of water and then filtered, washed, and then filtered. The resin powder was dried in vacuo at 70 ° C for 12 h.

[0067] T...

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Abstract

The invention discloses a polyamide-imide-polyimide copolymer molding compound and a preparation method thereof. In an aprotic polar solvent, the excess fluorine-containing diamine monomer and aromatic dianhydride are polymerized first. Generate polyamic acid, then add 1, 2, 4-trimellitic anhydride acid chloride to carry out polycondensation reaction, and then undergo imidization treatment to obtain the polyamide-imide-polyimide copolymer molding compound. The introduction of fluorine-containing diamine monomers can improve the wear resistance of the matrix, reduce the wear rate, improve the solubility of PAI and PI, improve the cyclization of the chemical imidization process, and improve the heat resistance of the material. It can improve the processing flow performance, so as to obtain special engineering plastics with high strength and good processing performance.

Description

Technical field [0001] The present invention belongs to the field of polymer materials, and more particularly to a polyamide imide-polyimide copolymerization resistant self-lubricating mold plastic. Background technique [0002] Polyimide mold plastic powder is a class of important application value, more typical engineering plastics, which can be injection molded, extruded or placed in a mold, pressed into high temperature high pressure, not only convenient transport, but also in the final molding There is no solvent release in the stage, and more complex components can be manufactured, so the market demand is increasing. Polyimide molded powders are widely used in aviation, aerospace, electrical, mechanical, chemical, microelectronics and other fields. [0003] The polyamideimide was first developed by AMOCO in 1972 and has been commercially available in 1976. Subsequently, Japan's Dongli Company has developed TI-5000 molded powder. Domestic plastics for polyamide is also studi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10
CPCC08G73/1039C08G73/1067C08G73/1071C08G73/1064
Inventor 杨海洋杨军王进甘顺昌曹凯凯刘含茂程海涛李笃信
Owner CENT SOUTH UNIV
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