Dendritic epoxy resin, its preparation method and its application

An epoxy resin and dendritic technology, which is applied in the direction of epoxy resin glue, epoxy resin coating, adhesive type, etc., can solve the problem of dendritic epoxy resin, dendritic epoxy resin can not better retain branches To solve problems such as shape structure and epoxy group, to achieve good adhesion and peel strength, low cost and short reaction cycle

Active Publication Date: 2022-05-06
WEIHAI CY DENDRIMER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the deficiencies in the prior art, the technical problem to be solved by the present invention is to overcome the fact that the existing dendritic epoxy resin cannot better retain the dendritic structure and epoxy groups, thereby affecting the application performance of the dendritic epoxy resin. , proposed a dendritic epoxy resin that can perfectly retain the dendritic structure and epoxy groups, has a short reaction cycle, simple production process, low cost, can meet industrial large-scale production, and has improved adhesion and bonding performance, and its preparation Method and its application

Method used

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Examples

Experimental program
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preparation example Construction

[0026] The invention provides a kind of preparation method of dendrimer, comprising the following steps:

[0027] S1: Add aliphatic polyglycidyl ether monomers and monoamino polyhydroxy monomers into the reactor, and prepolymerize at 25°C-100°C for 0.1-10 hours to form polymerized monomers;

[0028] S2: Then raise the temperature to 50°C-200°C and react for 0.5-120 hours to obtain dendrimers.

[0029] In this example, the direct melt reaction of commercially available aliphatic polyglycidyl ether monomers and monoamino polyhydroxy monomers is mainly used to obtain dendrimers by one-pot polymerization. Specifically, the above raw materials are prepolymerized under reaction conditions to form intermediates, and then further reacted to form dendrimers. Specifically, in the above process, the method of temperature programming is used to prepolymerize to form an intermediate, and then continue to react to form a dendritic polymer that meets the requirements. Compared with the exi...

Embodiment 1

[0043] Add 0.2mol of trimethylolpropane triglycidyl ether and 0.6mol of diethanolamine into a three-necked flask, first stir at room temperature for 30 minutes, then raise the temperature to 65°C for 12 hours, stop the reaction, and directly discharge and condense to obtain Light yellow transparent liquid to obtain dendritic polymer 1 with a yield of 99%.

Embodiment 2

[0045] Add 0.2mol of pentaerythritol tetraglycidyl ether and 0.8mol of diethanolamine into a three-necked flask, first stir at room temperature for 1 hour, then raise the temperature to 65°C for 16 hours, stop the reaction, and directly discharge and condense to obtain a light yellow transparent liquid , to obtain dendritic polymer 2 with a yield of 98%.

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PUM

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Abstract

The invention discloses a dendritic epoxy resin, a preparation method and an application thereof, and belongs to the field of dendritic polymers. Its technical scheme includes adding aliphatic polyglycidyl ether monomers and monoamino polyhydroxy monomers into the reactor, prepolymerizing at 25°C-100°C for 0.1-10 hours to form polymerized monomers; then raising the temperature to To 50°C-200°C, react for 0.5-120 hours to obtain a dendritic polymer, and prepare a dendritic epoxy resin on this basis. The invention is applied to adhesives or coatings, and solves the problem that the existing dendritic epoxy resins cannot better retain dendritic structures and epoxy groups, thus affecting the application performance of dendritic epoxy resins, and has the ability to perfectly retain Dendritic structure and epoxy group, short reaction cycle, simple production process, low cost, can meet the characteristics of large-scale industrial production, adhesion and bonding performance improvement.

Description

technical field [0001] The invention belongs to the field of dendritic polymers, in particular to a dendritic epoxy resin, its preparation method and its application. Background technique [0002] The overall level of my country's adhesive industry is not high, and the domestic adhesive market is showing a diversified development trend. Some high-end adhesive varieties still need to be imported, and most of the existing adhesive types have problems such as environmental pollution. Therefore, according to market demand, actively developing adhesives will become the mainstream of the adhesives market in the future. The low viscosity and high solubility of dendrimers can significantly reduce the use of solvents in the adhesive production process, opening up a new path for environmentally friendly adhesives. At present, the introduction of dendritic macromolecular structure into epoxy resin can further explore the synthesis and modification of epoxy resin, and seek epoxy resin ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/64C09D163/00C09J163/00
CPCC08G59/64C09D163/00C09J163/00
Inventor 李武松刘聪聪
Owner WEIHAI CY DENDRIMER TECH
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