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A carbon nanotube three-dimensional fin transistor and its preparation method

A fin transistor and carbon nanotube technology, applied in the field of carbon nanotube three-dimensional fin transistor and its preparation, can solve the problem of rising off-state current of logic devices, larger sub-threshold swing, and difficulty in continuing Moore's Law for field effect transistors, etc. problem, to achieve the effect of ensuring driving energy, increasing density, and reducing short channel effect

Active Publication Date: 2021-02-12
PEKING UNIV +2
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] With the continuous shrinking of the size of semiconductor devices, it is becoming more and more difficult for field effect transistors in traditional two-dimensional structure CMOS (Complementary Metal Oxide Semiconductor, Complementary Metal Oxide Semiconductor) integrated circuits to continue Moore's Law
And with the advancement of Moore's law and the shrinking of the size of logic devices, the short-channel effect is becoming more and more obvious, such as the increase of sub-threshold swing and the decrease of the potential barrier caused by the drain, which all lead to the exponential off-state current of logic devices. level up

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  • A carbon nanotube three-dimensional fin transistor and its preparation method
  • A carbon nanotube three-dimensional fin transistor and its preparation method
  • A carbon nanotube three-dimensional fin transistor and its preparation method

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Embodiment Construction

[0030] As described in the background technology, the traditional two-dimensional field effect transistor with two-dimensional structure has become more and more difficult to continue Moore's law. Therefore, the three-dimensional structure field effect transistor (Fin Field Effect Transistor (FinField -Effect Transistor, FinFET)) came into being, the channel of the three-dimensional field effect transistor is located in the protruding fin, this design can improve circuit control and reduce leakage current, and can shorten the gate length of the transistor, which is beneficial to Reduce transistor size.

[0031] In order to further improve the gate efficiency and drive current of the field effect transistor channel, refer to Figure 1-3 , a carbon nanotube three-dimensional fin transistor with a three-dimensional structure and using carbon nanotubes (Carbon Nanotubes) as a channel came into being, Figure 1-Figure 3 shows the general structure of this carbon nanotube 3D fin tr...

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Abstract

The present application discloses a carbon nanotube three-dimensional fin transistor and a preparation method thereof, wherein the carbon nanotube three-dimensional fin transistor is a kind of Dirac two-dimensional semi-metal source and drain based on an embedded gate fin Transistor structure, the carbon nanotube three-dimensional fin transistor with this structure can reduce the short channel effect of the carbon nanotube three-dimensional fin transistor while having a small size, because the Dirac two-dimensional semi-metal has a two-dimensional The ultra-thin structure, using it as the source and drain materials of the carbon nanotube three-dimensional fin transistor can reduce the electrostatic shielding effect of the source and drain on the gate electrode in the gate structure, thereby reducing the short-circuit of the carbon nanotube three-dimensional fin transistor. channeling effect. In addition, the carbon nanotube three-dimensional fin transistor can affect the potential distribution in the channel by applying a voltage on the embedded metal gate fin, thereby realizing discrete adjustment and control of the device threshold and realizing the function of dynamically controlling the device threshold.

Description

technical field [0001] The present application relates to the field of semiconductor technology, and more specifically, relates to a carbon nanotube three-dimensional fin transistor and a preparation method thereof. Background technique [0002] Moore's Law means that when the price remains constant, the number of components that can be accommodated on an integrated circuit will double every 18-24 months, and the performance will also double. [0003] With the continuous shrinking of the size of semiconductor devices, it becomes more and more difficult for field effect transistors in traditional two-dimensional structure CMOS (Complementary Metal Oxide Semiconductor, Complementary Metal Oxide Semiconductor) integrated circuits to continue Moore's Law. And with the advancement of Moore's Law and the shrinking of the size of logic devices, the short-channel effect is becoming more and more obvious, such as the increase of the sub-threshold swing and the decrease of the potenti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L29/78H01L29/45H01L29/16H01L21/336
CPCH01L29/16H01L29/45H01L29/66795H01L29/785
Inventor 徐琳张志勇彭练矛
Owner PEKING UNIV
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