Porous flat plate type radiator, porous flat plate type radiator system and manufacturing method of porous flat plate type radiator

A radiator, flat-panel technology, used in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problem of low heat dissipation efficiency of chip radiators, achieve high flatness, reduce contact thermal resistance, and efficient conduction Effect

Pending Publication Date: 2019-10-22
GUANGDONG INST OF INTELLIGENT MFG
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of low heat dissipation efficiency of existing electronic product chip heat sinks, the embodiment of the present invention provides a porous flat plate heat sink, system and manufacturing method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Porous flat plate type radiator, porous flat plate type radiator system and manufacturing method of porous flat plate type radiator
  • Porous flat plate type radiator, porous flat plate type radiator system and manufacturing method of porous flat plate type radiator
  • Porous flat plate type radiator, porous flat plate type radiator system and manufacturing method of porous flat plate type radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] refer to Figure 1-2 As shown, the radiator provided in this embodiment includes a radiator body 1, a cavity 11 is formed inside the radiator body 1, and a porous structure 12 is formed on the bottom inner wall of the cavity 11; There is a heat pipe working medium; the outer surface of the bottom of the cavity 11 is ground into a plane, which serves as a heat transfer contact plane. By forming a porous structure on the inner wall of the bottom of the cavity 11 opposite to the heat transfer contact plane, heat conduction can be realized effectively and quickly, so that the heat generated by the heating element (such as CPU) that the heat transfer contact plane is in contact with can be quickly and efficiently Efficient conduction, the porous structure is the core of vaporization, which can effectively improve the heat transfer efficiency; at the same time, because the heat transfer contact plane is a plane formed by grinding, the flatness of its contact with the heating ...

Embodiment 2

[0033] refer to image 3 As shown, it is a schematic structural diagram of the radiator system provided by this embodiment, which is mainly composed of two radiators 100 and a connecting pipe 200 communicating between the two radiators 100 . Wherein, the two radiators 100 used are the radiators described in Embodiment 1, and the heat pipe medium can be injected after the connecting pipe 200 communicates with the two radiators. Such as Figure 4 As shown, in a specific application, the heat transfer contact plane of one heat sink 100 is in contact with the chip 300, and the heat transfer contact plane of the other heat sink 100 is in contact with the cooling fan 400, so that the heat generated by the chip can be quickly dissipated. Passed to a fan for cooling. In addition, in order to further improve the heat transfer efficiency, the connecting pipe is also made of copper.

Embodiment 3

[0035] This embodiment provides a method for manufacturing a porous flat plate radiator, comprising the following steps:

[0036] Prepare a rectangular copper container;

[0037] Mix and stir 20%-80% of 10-100 micron copper fiber and 80%-20% of 10-100 micron copper powder;

[0038] Place the above-mentioned copper fiber copper powder mixture in the cavity;

[0039] Put the above-mentioned rectangular copper container containing copper fiber and copper powder into a vacuum sintering furnace for sintering, and the sintering vacuum degree is lower than 5×10 -2 Pa, the sintering temperature is 800-1000° and the temperature is kept for 0.5h to 1h, so that the copper fiber, copper powder and rectangular copper cavity are solid-phase metallurgically bonded, and the sintering forms a fine and uniform porous structure; due to the sintering of the copper cavity, a dense The uniform porous structure is conducive to the rapid and uniform conduction of heat, which can greatly improve the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a porous flat plate type radiator, a porous flat plate type radiator system and a manufacturing method of a porous flat plate type radiator. The porous flat plate type radiatorcomprises a radiator body, wherein a cavity is formed in the radiator body, and a porous structure is formed on the inner wall of the bottom of the cavity; a heat pipe working medium is arranged in the cavity; the outer surface of the bottom portion of the cavity is ground flat to serve as a heat transfer contact plane. The porous structure is formed on the inner wall of the bottom of the cavityopposite to the heat transfer contact plane, so that heat conduction can be effectively and quickly achieved, heat generated by a heating element (such as a CPU) being in contact with the heat transfer contact plane is quickly and efficiently conducted, and the porous structure is used as a core of vaporization and can effectively improve the heat transfer efficiency; and meanwhile, the heat transfer contact plane is a plane formed by grinding, so that the flatness of the contact position of the heat transfer contact plane and the heating element is high, the contact thermal resistance can bereduced, and the heat transfer efficiency can be further improved.

Description

technical field [0001] The invention relates to a radiator, in particular to a porous plate radiator, a system and a manufacturing method. Background technique [0002] The heat pipes used in the chip radiators of existing electronic products are round pipes that are flattened to become flat and in contact with the chip. After the round pipe is flattened, it is difficult to ensure the flatness, and there is a gap between the contact with the chip to cause thermal resistance. At the same time, the inner wall of the round pipe generally does not have porous materials. , fewer vaporized cores, and lower heat dissipation efficiency. Contents of the invention [0003] In order to solve the problem of low heat dissipation efficiency of existing electronic product chip radiators, the embodiments of the present invention provide a porous plate radiator, a system and a manufacturing method. [0004] For realizing the above object, technical scheme of the present invention is: [...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L23/367H01L23/427H01L23/467H01L21/48
CPCH01L23/367H01L23/427H01L23/467H01L21/4803
Inventor 唐观荣杨德志周雪峰程韬波
Owner GUANGDONG INST OF INTELLIGENT MFG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap