Method for manufacturing solder mask layer for improving hole plugging caused by solder resist ink

A technology of solder mask ink and production method, which is applied in the application of non-metallic protective layer, secondary treatment of printed circuit, processing of photosensitive materials, etc. The effect of increasing the washing pressure and reducing the production cost

Inactive Publication Date: 2019-10-15
珠海崇达电路技术有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the solder resist ink is prone to clogging holes when making the solder resist layer during the production process of the PCB, and provides a method for manufacturing the solder resist layer that improves the problem of solder resist ink clogging by optimizing the manufacturing process

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] This embodiment provides a method for manufacturing a solder resist layer that improves the blocking of holes with solder resist ink, which includes sequentially performing pre-solder resist treatment, silk screen solder resist ink, pre-baking, exposure, development, post-baking, and laser hole-burning processing on the production board process. The production board of this embodiment is a production board for testing, and the board thickness is about 1.5mm. On the board, some pads and some welding hole units arranged in a matrix are arranged. Each welding hole unit consists of 9 rows and each row has 9 rows. It consists of two welding holes, the welding holes are through holes with a diameter of 0.3mm.

[0018] Specific steps are as follows:

[0019] (1) Pre-treatment of solder resist: Grind the production board according to the conventional grinding process to clean and roughen the board surface, enhance the bonding force between the board surface and the solder resi...

Embodiment 2

[0030] This embodiment provides a method for manufacturing a solder resist layer that improves the blocking of holes with solder resist ink, which includes sequentially performing pre-solder resist treatment, silk screen solder resist ink, pre-baking, exposure, development, post-baking, and laser hole-burning processing on the production board process. The production board of this embodiment is a production board for testing, which is the same as that of Embodiment 1.

[0031] The difference between the manufacturing method of the solder resist layer and that of Example 1 lies in the control of the development process. The development process of this embodiment is as follows: The development process includes spraying of developing chemicals, preliminary rinsing, pressurized water washing, water washing, and strong wind blowing. Steps of drying and drying with hot air. The mass percent concentration of the developing solution is 0.9-1.1%. During the spraying process of the de...

Embodiment 3

[0034] This embodiment provides a method for manufacturing a solder resist layer that improves the blocking of holes with solder resist ink, which includes sequentially performing pre-solder resist treatment, silk screen solder resist ink, pre-baking, exposure, development, post-baking, and laser hole-burning processing on the production board process. The production board of this embodiment is a production board for testing, which is the same as that of Embodiment 1.

[0035] The difference between the manufacturing method of the solder resist layer and that of Example 1 lies in the setting of the shower head during the developing process. In this embodiment, a fan-shaped shower head is used for spraying during the spraying process of the developing liquid.

[0036] For the 10 production boards processed by the method of this embodiment, after the development process is completed, more solder resist ink remains in some welding holes on the production board, which increases th...

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PUM

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Abstract

The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a solder mask layer for improving hole plugging caused by solder resist ink. According to the method, the developing effect is improved by optimizing a developing speed, a developing pressure and a washing pressure, the solder resist ink leaked into a hole can be effectively removedin the optimized developing process, and the exposed and cured solder resist ink on a plate surface cannot be affected, so that the solder resist ink going deep into the hole after the post-baking process is prevented from being thermally cured to block the hole. In addition, laser hole burning treatment is added after the post-baking process, so that solder resist ink possibly remained in the hole can be removed, the solder resist ink in the hole can be completely removed, and the hole forming quality is guaranteed. The solder mask layer manufactured by the method can solve the problem of hole plugging caused by solder resist ink, avoids the process of repairing a production plate additionally due to the hole plugging caused by solder resist ink, improves the production efficiency, and reduces the production cost.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for manufacturing a solder resist layer for improving hole blocking by solder resist ink. Background technique [0002] In the production process of PCB, after the outer circuit is produced, it is necessary to make a solder resist layer on the surface of the production board except for the pad and the welding hole (the hole that needs to be soldered) to protect the circuit on the board. The process of making a solder mask layer on a PCB is generally followed by solder mask pretreatment, silk screen printing, pre-baking, exposure, development, and post-baking. In order to prevent the solder resist ink from flowing into the welding hole and blocking the hole when the solder resist ink is printed, it is necessary to make a corresponding screen printing dot net according to the settings of the pad and welding hole before silk screen printing, and block the wel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28G03F7/30
CPCG03F7/30H05K3/28
Inventor 刘丽娟罗练军刘琪刘亚飞
Owner 珠海崇达电路技术有限公司
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