Diamond wire cutting liquid and preparation method and application thereof

A technology of diamond wire cutting and raw materials, applied in the petroleum industry, lubricating compositions, etc.

Active Publication Date: 2019-10-01
SHANGHAI SINYANG SEMICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to overcome the defects of cutting fluid in the prior art, such as dispersibility of chips, cutting accuracy, wettability, defoaming property or friction coefficient, and to provide a diamond wire cutting fluid and its preparation method and application

Method used

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  • Diamond wire cutting liquid and preparation method and application thereof
  • Diamond wire cutting liquid and preparation method and application thereof
  • Diamond wire cutting liquid and preparation method and application thereof

Examples

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Embodiment 1～5

[0085] Table 1

[0086]

[0087]

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Abstract

The invention discloses a diamond wire cutting liquid and a preparation method and application thereof. The diamond wire cutting liquid is prepared from, by mass percentage, 10-30% of a high molecularpolymer, 10-40% of polyethylene glycol 10000, 10-20% of polyethylene glycol 20000, 1-10% of polyquaternium-10, 10-30% of a polyol ether compound, 1-5% of glycine and the balance water, wherein the percentage is the mass percentage of each component in the total mass percentage of all the components, and the high molecular polymer is polyethylene glycol modified hyperbranched polyether ester. Thediamond wire cutting liquid has good comprehensive performance.

Description

technical field [0001] The invention relates to a diamond wire cutting fluid and its preparation method and application. Background technique [0002] At present, there are two main ways to cut silicon wafers: one is free abrasive cutting, and the other is fixed abrasive cutting. Among them, the free abrasive method tends to be gradually eliminated, and its existing problems include: when the steel wire is thick, the cutting loss becomes larger. Therefore, when cutting silicon wafers, a large amount of cutting powder is produced, the product yield is low when cutting silicon ingots, and there is a limit to the thinning of steel wires. The fixed abrasive cutting method is more and more widely used because of its ability to make steel wire thinner, reduce cutting powder, and have higher yield. [0003] In order to improve product yield, higher and higher requirements are put forward for the diamond wire cutting fluid with fixed abrasives: for example, to reduce the friction ...

Claims

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Application Information

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IPC IPC(8): C10M173/02C10N30/12C10N30/16C10N30/18C10N30/06
CPCC10M173/02C10M2207/046C10M2209/104C10M2209/109C10M2215/04C10M2217/022C10M2217/028C10M2217/06C10N2030/06C10N2030/12C10N2030/16C10N2030/18
Inventor 方书农蔡进马雪彦黄卫东
Owner SHANGHAI SINYANG SEMICON MATERIALS
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