Composite fluorine polymer high-frequency high-transmission dual-side copper foil substrate and fabrication method thereof

Abstract

The invention discloses a composite fluorine polymer high-frequency high-transmission dual-side copper foil substrate and a fabrication method thereof. The dual-side copper foil substrate sequentiallycomprises a first copper foil layer, a first insulation polymer layer, a first extremely-low dielectric glue layer, a core layer, a second extremely-low dielectric glue layer, a second insulation polymer layer and a second copper foil layer from top to bottom, wherein the first insulation polymer layer and the second insulation polymer layer both are fluorine polymer layers, the first insulationpolymer layer and the second insulation polymer layer both are insulation layers with Dk values being 2.0-3.50 and Df values being 0.0002-0.001, and the first copper foil layer and the second copper foil layer both are low-profile copper foil layers with Rz values being 0.1-1.6 micrometers. The dual-side copper foil substrate and an FPC have favorable electricity and also have the advantages of cost, relatively short processing flow, low thermal expansion coefficient, stable dk / df performance under a high-temperature humidity environment, ultralow water absorption rate, favorable UV laser drilling capability, low elastic force, high-density assembly and excellent mechanical property.

Description

technical field [0001] The invention relates to the technical field of FPC (flexible circuit board) and its preparation, in particular to a double-sided copper foil substrate. Background technique [0002] With the rapid development of information technology, in order to meet the needs of high-frequency and high-speed signal transmission, rapid heat dissipation and heat conduction, and minimize production costs, the design and application of various forms of mixed-pressure multilayer boards are in the ascendant. Printed circuit boards are an indispensable material in electronic products, and as the demand for consumer electronics grows, the demand for printed circuit boards is also increasing. Due to the flexible printed circuit board (FPC, Flexible Printed Circuit) has the characteristics of flexibility and three-dimensional space wiring, under the development trend of scientific and technological electronic products emphasizing lightness, shortness, flexibility, and high f...

AI Technical Summary

Problems solved by technology

In addition, the high-frequency boards currently used in the industry are mainly LCP (liquid crystal polymer) boards and PTFE (polytetrafluoroethylene) fiber boards. (>280°C) can be operated, which also causes uneven film thickness. Uneven film thickness will make it difficult to control the impedance value of the circuit board, and the high-temperature pressing process will cause LCP or PTFE extrusion to affect the plating. The conductivity of copper forms an open circuit, which leads to poor reliability and a decrease in reliability; in addition, it is faced with the inability to use fast press equipment, resulting in processing difficulties; in addition, in SMT (surface mount) high temperature process or other FPC process , such as bending, strong acid and strong alkali liquid process, the subsequent strength is insufficient, resulting in a drop in yield

Although other resin films do not have the above problems, they face problems such as poor electrical properties or poor mechanical strength.

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