Anti-damage and anti-collision packaging material for fungi and production method thereof

Abstract

The invention discloses a fungus loss and collision prevention packing material. The packing material comprises 30 to 40 parts of fibrous grass, 40 to 50 parts of ductile cut straws, 20 to 30 parts ofa cottonseed hull culture material, and 20 to 25 parts of a biological association binder. The invention further comprises a production method of the fungus loss and collision prevention packing material. The method comprises the following steps: step 100, performing pretreatment of raw materials; step 200, performing primary fungus seedling cultivation; step 300, performing extrusion to form a fiber board and a straw board; step 400, performing multi-board overlaid extrusion; step 500, performing secondary fungus penetration cultivation. The packing material improves the reproduction growthcapacity of fungal hyphac, improves the stability and impact resistance of an integral material, reduces the quality of the packing material, divides different materials into different extruded boards, and can form different combinations of extruded board overlaid materials according to production demands, thereby being capable improving the impact force prevention, further improving the application range, improving the adhesive capacity inside a single extruded board and improving the structural stability.

Description

technical field [0001] The invention relates to the field of biomass composite materials, in particular to a fungus anti-damage and anti-collision packaging material and a production method thereof. Background technique [0002] At present, the packaging materials of commodities on the market are mainly petroleum-based composite materials such as expanded polystyrene (EPS), which are widely used due to their light weight, low moisture absorption rate, excellent cushioning performance and low cost. Used in the field of packaging. However, due to the stable chemical properties of materials such as polystyrene, they will not be degraded within 200 years after being discarded in the natural environment after use, thus causing serious "white pollution" to the society, and their recycling costs a lot. Therefore, it is imperative to find an environmentally friendly packaging material. In recent years, it has become a new research direction to use crop resources to develop new fib...

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Problems solved by technology

[0005] For example, the application number is CN106752013.0, and the patent name is the invention patent of fungal-based biomass packaging material with corn cob as the main material and its preparation method. The production method does not consider the growth of fungal filaments on different biomass materials. Unified growth of fungal filaments mixed with all substances, resulting in poor damage and impact resistance of packaging materials

[0006] Based on the above technical solutions and the existing production methods of biomass packaging materials, the use of fungi to make anti-damage and anti-collision packaging materials has the following defects: the fungal filaments are uniformly cultivated with all materials, resulting in slow cultivation of the fungal filaments and prolonged The period of the manufacturing process, and when the fungal filaments are cultivated, due to the difference in the normal ability of different materials, the adhesion ability of the material between the biomass is different, which reduces the overall connection ability of the packaging material and poor impact resistance

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