Logistics state monitoring method and system based on combination of sensors

Abstract

The invention discloses a logistics state monitoring method and system based on combination of sensors. The system comprises intelligent labels, each intelligent label is composed of a label casing, amicrocontroller, a sensor module, a wireless communication module and a power supply module, the label casing is mounted in the surface of a transport cargo, the microcontroller is responsible for work task scheduling of the whole system, via interconnection of different types of sensors, the sensor module can realize sensor data collection and event modeling calculation in the cargo transport environment, events include shocking, collision, overturning, falling off, unsealing and temperature and humidity imbalance, and the wireless communication module sends the sensor data, time label and event record to a monitoring mobile terminal or remote cloud server. Thus, real-time state and event record information of cargoes in the production material transmission and logistics transport process can be monitored effectively, alarm is raises against damage of cargoes timely, and safe transport of sensitive products can be monitored accurately and effectively.

Description

technical field [0001] The invention belongs to the technical field of logistics, and in particular relates to a method and system for monitoring logistics status based on multi-sensor fusion. Background technique [0002] In the logistics process, large and valuable goods may be damaged due to factors such as dumping and collision during loading and unloading, and bumps and vibrations during transportation. At present, most of the existing anti-collision and anti-shock label products are realized in a non-intelligent way based on physical detection. The transport personnel cannot obtain the abnormal transportation status of the goods in real time, and cannot determine the responsible person in time when the goods are damaged. At the same time, the maturity and development of semiconductor technology has also reduced the cost of electronic sensors, making sensors more and more widely used. Contents of the invention [0003] The object of the present invention is to provid...

AI Technical Summary

Problems solved by technology

At present, most of the existing anti-collision and anti-shock label products are realized in a non-intelligent way based on physical detection. The transportation personnel cannot obtain the abnormal transportation status of the goods in real time, and cannot determine the responsible person in time when the goods are damaged.

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