Wet etching equipment and photoresist cleaning and developing device

Abstract

The invention discloses a wet etching equipment and a photoresist cleaning and developing device. The wet etching equipment comprises: a casing, a control panel is arranged on the outer wall of the casing; a liquid carrier basin is arranged in the casing for Hold the solution; the basin edge of the liquid carrier basin is fixedly connected with the inner wall of the shell; the ultrasonic atomizer is fixed at the bottom of the liquid carrier basin, and is used to atomize the solution in the liquid carrier basin into droplets; On the edge of the liquid-carrying basin, it is used to hold the device to be etched; the device to be etched is separated from the solution; the power supply module is located at the bottom of the housing; the ultrasonic atomizer is electrically connected to the control panel; the ultrasonic fog Both the carburetor and the control panel are electrically connected to the power supply module. The etching flower basket is used to separate the etched device from the solution, and the ultrasonic atomizer is used to atomize the etching solution, and the device is etched by atomized droplets, so that the fine and complex structures such as hollows and grids are released smoothly, providing fine etching The success rate of complex structures.

Description

technical field [0001] The invention belongs to the technical field of MEMS (micro-electromechanical systems), and in particular relates to a wet etching device and a photoresist cleaning and developing device. Background technique [0002] Photolithography is an important step in the manufacturing process of semiconductor devices. This step uses exposure and development to describe the geometric pattern structure on the photoresist layer, and then transfers the pattern on the photomask to the substrate by etching. [0003] Etching is most commonly divided into: dry etching and wet etching. Wet etching is a purely chemical reaction process, which refers to using the chemical reaction between the solution and the pre-etching material to remove the part not masked by the masking film material to achieve the purpose of etching. [0004] However, the existing wet etching usually puts the required etching device into the etching solution and soaks it. When this process method is...

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Problems solved by technology

[0004] In the existing wet etching, the required etching device is usually soaked in the etching solution. When this process method is used to etch the small-sized (5 micron) complex and precise device structures such as hollows and grids, when it is used When the etching device leaves the etching liquid surface, due to the surface tension of the liquid, the fine structures such as hollows and grids will be broken and broken

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