Novel electronic material with high thermal stability and preparation method thereof
A technology with high thermal stability and new materials, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, epoxy resin glue, etc., can solve the problem of affecting the service life of LEDs, cracking of epoxy packaging materials, thermal stability Poor performance and other problems, to achieve the effect of improving crack resistance, reducing self-aggregation, and improving crack resistance
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example 1
[0042] A new electronic material with high thermal stability, mainly including: 65 parts of epoxy resin E-44, 10 parts of diglycidyl ether, 15 parts of aluminum powder, 8 parts of curing agent, 18 parts of additives, 24 parts by weight Parts of modified titanium dioxide, 5 parts of zinc chloride, 10 parts of epoxidized soybean oil.
[0043] A method for preparing new electronic materials with high thermal stability, the method for preparing new electronic materials with high thermal stability mainly includes the following preparation steps:
[0044] (1) Mix nano-silica and polyacrylic acid in a beaker at a mass ratio of 1:2, and add N,N-dimethylformamide, which is 300 times the mass of nano-silica, to the beaker at a temperature of 90°C , under the condition of rotating speed of 360r / min, stir and mix for 80min to obtain nano-silica mixed dispersion, mix nano-silica mixed dispersion with 4-dimethylaminopyridine at a mass ratio of 200:1, and add 4- N,N'-dicyclohexylcarbodiimid...
example 2
[0054] A new electronic material with high thermal stability, mainly including: 65 parts of epoxy resin E-51, 10 parts of diglycidyl ether, 15 parts of aluminum powder, 8 parts of curing agent, 18 parts of additives, 24 parts by weight. Parts of modified titanium dioxide, 5 parts of zinc chloride, 10 parts of epoxidized soybean oil.
[0055] A method for preparing new electronic materials with high thermal stability, the method for preparing new electronic materials with high thermal stability mainly includes the following preparation steps:
[0056] (1) Mix nano-silica and polyacrylic acid in a beaker at a mass ratio of 1:2, and add N,N-dimethylformamide, which is 300 times the mass of nano-silica, to the beaker at a temperature of 90°C , under the condition of rotating speed of 360r / min, stir and mix for 80min to obtain nano-silica mixed dispersion, mix nano-silica mixed dispersion with 4-dimethylaminopyridine at a mass ratio of 200:1, and add 4- N,N'-dicyclohexylcarbodiimi...
example 3
[0066] A new electronic material with high thermal stability, mainly including: 65 parts of epoxy resin E-44, 10 parts of diglycidyl ether, 15 parts of aluminum powder, 8 parts of tetraethylenepentamine, 18 parts of additives in parts by weight , 24 parts of modified titanium dioxide, 5 parts of zinc chloride, 10 parts of epoxidized soybean oil.
[0067] A method for preparing new electronic materials with high thermal stability, the method for preparing new electronic materials with high thermal stability mainly includes the following preparation steps:
[0068] (1) Mix nano-silica and diisocyanate at a mass ratio of 1:1, and add anhydrous acetone 30 times the mass of nano-silica and epoxy resin solution 5 times the mass of nano-silica, in a nitrogen gas atmosphere Under the conditions of temperature 150°C and rotation speed 320r / min, after stirring and reacting for 24 hours, filter and dry under the condition of temperature 80°C;
[0069] (2) Mix the substance obtained in s...
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