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Thermosetting resin composition and prepreg and laminated board prepared by using composition

A resin composition, thermosetting technology, applied in chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of insufficient rigidity, poor heat resistance, low glass transition temperature, etc.

Active Publication Date: 2019-06-11
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a large number of studies have shown that although hydrocarbon resins can provide good dielectric properties, due to the flexibility and non-polar carbon chain structure of hydrocarbon resins, hydrocarbon resins have insufficient rigidity, low strength, and poor heat resistance after curing. , low glass transition temperature, poor adhesion and other problems, there are still many problems to be solved in practical applications

Method used

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  • Thermosetting resin composition and prepreg and laminated board prepared by using composition
  • Thermosetting resin composition and prepreg and laminated board prepared by using composition
  • Thermosetting resin composition and prepreg and laminated board prepared by using composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0081] Put 1000g of tetrahydrofuran, 100g of dicyclohexylcarbodiimide, 58.8g of maleic anhydride, and 228g of bisphenol A into the three-necked reaction flask, fully dissolve them, put them in the three-necked reaction flask and mix them thoroughly, and then add a catalytic amount of 4-dimethylaminopyridine, reacted at room temperature for 5 hours, then separated and purified the product to obtain active ester resin A-1, and the hydroxyl functional group equivalent in the active ester (A-1) resin was calculated as 690 grams / equivalent based on the input ratio (58.8+228-18*0.6=276, 276 / 0.4=690), the ester group functional equivalent is 230 g / equivalent based on the input ratio, and the unsaturated double bond functional equivalent is 460 g / equivalent.

[0082] In a flask equipped with a thermometer, dropping funnel, condenser, shunt pipe, and stirrer, put 1000 g of methyl isobutyl ketone into the solvent, then take 276 g of resin A-1 and put it into the flask to fully dissolve. ...

Synthetic example 2

[0084] Put 1000g of tetrahydrofuran, 100g of dicyclohexylcarbodiimide, 58.8g of maleic anhydride, and 160g of 2,7 dihydroxynaphthalene into the three-neck reaction flask, fully dissolve them, mix them fully in the three-neck reaction flask, and then add A catalytic amount of 4-dimethylaminopyridine was reacted at room temperature for 5 hours, and then the product was separated and purified to obtain an active ester resin (A-2), and the hydroxyl functional group equivalent in the active ester (A-2) resin was calculated based on the input ratio It is 520 g / equivalent (58.8+160-18*0.6=208, 208 / 0.4=520), the ester group functional equivalent is 173 g / equivalent based on the input ratio, and the unsaturated double bond functional equivalent is 347 g / equivalent.

[0085] In a flask equipped with a thermometer, dropping funnel, condenser, shunt pipe, and stirrer, put 1000 g of solvent methyl isobutyl ketone, then take 208 g of resin A-2 into the flask, and fully dissolve it. Nitrogen...

Embodiment 1～8 and comparative example 2～3

[0090] According to the formula shown in table 1, at first it is necessary to prepolymerize the unsaturated polyester active ester, ethylenic crosslinking agent and initiator in embodiment 5 into prepolymer according to the method of embodiment 1, and the unsaturated polyester in embodiment 6 Saturated polyester active ester, ethylenic crosslinking agent, and initiator are prepolymerized into a prepolymer according to the method in Example 2. Examples 3-4, Examples 7-8 and Comparative Examples 2 and 3 did not carry out pre-polymerization, but ordinary physical blending, which will not be specifically described here.

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Abstract

The present invention discloses a thermosetting resin composition. The composition comprises the following components, in parts by weight: (a) 100 parts of epoxy resin; (b) 50-200 parts of unsaturatedpolyester active ester resin; (c) 10-200 parts of vinyl benzyl modified phenolic resin; and (d) 0.05-4 parts of an accelerant. According to the composition provided by the invention, the unsaturatedpolyester active ester resin can effectively combine an active ester curing epoxy resin system, a hydrocarbon resin curing system and a vinyl benzyl modified phenolic resin system through chemical bonding, the excellent properties of the active ester curing epoxy system, the excellent properties of the hydrocarbon resin and the excellent properties of the vinyl benzyl modified phenolic resin system are combined effectively, so that the resin composition has excellent dielectric properties, heat resistance, strength, stiffness flexibility, high peeling strength, a low water absorption ratio anda low heat shrinkage ratio after being cured, and can be applied to high-speed high-frequency printed circuit boards.

Description

technical field [0001] The invention relates to a thermosetting resin composition and a prepreg and a laminate prepared by using the composition, belonging to the technical field of electronic materials. Background technique [0002] In recent years, with the continuous advancement of high-speed and high-frequency technologies for information processing and information transmission, higher and higher requirements have been put forward for printed circuit substrate materials in terms of dielectric properties. To put it simply, printed circuit substrate materials need to have lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, expect to provide a kind of thermosetting resin composition, the printed circuit board material that uses this thermosetting resin composition to make can show sufficiently low low dielectric constant and low dielectric consta...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L67/06C08L61/14C08G63/52C08F283/10C08F283/01C08F283/00C08F212/08C08J5/24B32B15/14
Inventor 何继亮陈诚王宁黄荣辉马建崔春梅储正振
Owner SHENGYI TECH SUZHOU
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