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High heat flow density heat dissipation cold plate

A high heat flux density, heat dissipation cold plate technology, applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of large micro-channel pressure drop, easy blockage of channels, complex processing, etc., to achieve low superheat and demand for working fluid Less heat dissipation effect

Pending Publication Date: 2019-05-31
合肥低碳研究院
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the pressure drop of microchannels is generally relatively large, which is also one of the main reasons that limit its engineering application. In addition, problems such as complicated processing, easy blockage of channels, and excessive temperature rise are also the main reasons that limit its wide application.

Method used

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  • High heat flow density heat dissipation cold plate
  • High heat flow density heat dissipation cold plate
  • High heat flow density heat dissipation cold plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A high heat flux cooling cold plate, such as figure 1 As shown, it includes an upper cover plate 1, a micro nozzle plate 2 and a cold plate body 3; the micro nozzle 2 is located between the upper cover plate 1 and the cold plate body 3, and the upper cover plate 1 and the cold plate body 3 are passed through bolts (not shown in the figure). )connect.

[0049] like figure 2 As shown, the upper cover 1 is columnar, and the top of the upper cover 1 is provided with a first liquid inlet 11, and the number of the first liquid inlets 11 can be set according to actual needs; Plate cavity 12, the upper end of the upper cover plate cavity 12 communicates with the first liquid inlet 11; the surroundings of the upper cover plate 1 are respectively provided with first protrusions 13, and the shape of the first protrusions 13 can be set according to actual needs. The center of a protrusion 13 is provided with a threaded hole.

[0050] The micronozzle plate 2 is provided with som...

Embodiment 2

[0056] The difference between this embodiment and embodiment 1 is: as Figure 5 As shown, a piezoelectric atomizing nozzle is installed in the through hole of the micro-nozzle plate 2, and the piezoelectric atomizing nozzle includes a stainless steel plate 221, a piezoelectric atomizing sheet 222, a first silica gel sheet 223 and a second silica gel sheet 224, the first The silica gel sheet 223 is provided with a first through hole 2231, the second silica gel sheet 224 is provided with a second through hole 2241, the stainless steel plate 221 is provided with a third through hole 2211, and the bottom of the stainless steel plate 221 is provided with a first silica gel in turn. The sheet 223, the piezoelectric atomizing sheet 222, the second silica gel sheet 224, the first through hole 2231, the second through hole 2241 communicate with the third through hole 2211, and the piezoelectric atomizing sheet 222 is located directly below the first through hole 2231; Wherein the stain...

Embodiment 3

[0060] This embodiment also includes: Image 6 As shown, the liquid distributor 14, the liquid distributor 14 is arranged on the liquid inlet 11, the section of the liquid distributor 14 is Y-shaped, and the liquid distributor 14 is provided with 2 second liquid outlets 141 and 1 second liquid outlet 141. The liquid inlet 142 and the second liquid outlet 141 communicate with the second liquid inlet 142 respectively; the number of the first liquid inlet 11 is 2 in the present embodiment, and the inner side of the cold plate body 3 is a straight rib type, triangular Rib or pin rib.

[0061] The working principle of this embodiment: the liquid enters from the second liquid inlet 142 of the liquid separator 14 , and flows into the pressure swirl nozzle or piezoelectric atomizing nozzle from the second liquid outlet 141 .

[0062] Beneficial effects of this embodiment: through the liquid separator 14, it is convenient for the liquid to enter the pressure swirl nozzle or the piezoe...

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Abstract

The invention discloses a high heat flow density heat dissipation cold plate and relates to the technical field of electronic component heat dissipation. The high heat flow density heat dissipation cold plate comprises an upper cover plate and a cold plate body, wherein the upper cover plate is provided with a first liquid inlet; a micro nozzle plate is disposed between the upper cover plate and the cold plate body, and is provided with a plurality of micro nozzles; the first liquid inlet communicates with the micro nozzles; the cold plate body is provided therein with a cold plate cavity; thelower end of the cold plate body is provided with a first liquid outlet; and the first liquid outlet communicates with the cold plate cavity. The high heat flow density heat dissipation cold plate exchanges heat of heat-generating components by the cold plate cavity, requires less working mediums, is good in heat dissipation and low in degree of superheat and has no contact thermal resistance ona solid surface.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic components, in particular to a heat dissipation cold plate with high heat flux density. Background technique [0002] With the development of high integration of electronic chips, their power consumption is also increasing, and the heat flux density of electronic chips and other components is increasing, and heat dissipation has become one of the key issues restricting their development. Therefore, the thermal management of electronic chips and other components The demand is constantly increasing, and we need to find a heat dissipation method with high heat flux density to meet the heat dissipation requirements of electronic chips. [0003] At present, electronic chips and other components are mainly cooled by heat pipes and cold plates. Heat pipe cooling is mainly to transfer the heat of electronic chips and other components to heat pipes. The thermal conductivity of heat ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/473H01L23/367
Inventor 程文龙江李加赵锐年永乐
Owner 合肥低碳研究院
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