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Light-fixable casting compound and method for selective casting substrates/components using said compound

A technology of composition and substrate, applied in the direction of coating, epoxy coating, etc., can solve the problems of inability to achieve high tolerance, different expansion, tension of parts, etc.

Active Publication Date: 2019-04-16
DELO INDKLEBSTOFFE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is the highly selective pouring with two different materials
In general, (meth)acrylate-based UV-curable compositions do not achieve high resistance to prolonged exposure to temperature and humidity
Additionally, combining incompatible compositions during thermal stress can lead to differential expansion of the dam and fill material, creating tension on the part, which can lead to fracture of thin bond wires

Method used

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  • Light-fixable casting compound and method for selective casting substrates/components using said compound
  • Light-fixable casting compound and method for selective casting substrates/components using said compound
  • Light-fixable casting compound and method for selective casting substrates/components using said compound

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manufacture example

[0170] To make the composition according to the present invention, the liquid components are first mixed, and then fillers and other solids are incorporated by means of a laboratory stirrer, laboratory dissolver or speed mixer (Hauschild) until a homogeneous composition is formed.

[0171] The comparative example can be similarly manufactured.

[0172] The compositions of the compositions according to the present invention and comparative examples are listed in the table below. Percents refer to weight percentages, each based on the total weight of the composition.

[0173] In order to make the (meth)acrylate modified composition described in the following example, a commercially available filled anhydride cured one-component epoxy resin composition was used, each of which was added with (meth)acrylate . In order to compensate for the dilution effect of the added radiation curable components, some additional fillers are added so that the filling level remains unchanged compared to ...

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Abstract

The invention relates to heat-curing and light-fixable compounds, which are liquid at room temperature and are epoxy-based, and which comprise at least one epoxy-containing compound (A) having at least two epoxy groups, at least one hardener (B) for the epoxy-containing compound, optionally an accelerator (C), at least one radiation-hardening compound (D), at least one photoinitiator (E) for radical polymerization, and at least one filler material (F). The radiation-hardening compound (D) comprises at least one, at least trifunctional (meth)acrylate. The epoxy compound can be in particular used for fixing and / or selectively encapsulating electrical, electronic, and / or electromechanical components, and / or for adhering, coating, and sealing.

Description

Technical field [0001] The present invention relates to a thermosetting and light-fixable epoxy-based composition that is liquid at room temperature, the epoxy-based composition is particularly used for fixing and / or packaging parts, and to the use of the composition for packaging Component method. [0002] In particular, the present invention relates to a high-reliability composition and a curing agent based on a heat-curable epoxy resin, which also contains at least one radiation curing compound and a photoinitiator for radical polymerization. The composition according to the invention can first be fixed by irradiation and then thermally cured. Because they have achieved high profile stability during the irradiation step, these compositions are particularly suitable for rapid casting processes. After the thermal curing step, the composition according to the invention is characterized by high mechanical reliability, low coefficient of thermal expansion, in particular high resis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/00C08G59/42C09D163/00C08L63/00
CPCC09D4/00C09D163/00C08L63/00C08G59/42C08K3/36C08K5/0025C08L33/08C08F222/103C08K3/013C08L33/068C08L33/26C08G59/245C08G59/28C08G59/508C08G59/623C08L33/10
Inventor 莫里茨·赖希威尔塞尔安哥拉·斯塔尔克托比亚斯·柯尼格尔拉尔夫·克迈特
Owner DELO INDKLEBSTOFFE
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