25G optical module

Abstract

The invention belongs to the field of electronic communication devices, and relates to a 25G optical module. According to the specific technical schemes of the invention, the 25G optical module includes an optical module main body and a housing; the housing includes a base portion; a heat dissipation portion is disposed on the base portion; a mounting channel is formed in at least one side wall adjacent to the opening of the base portion; a movable block is arranged in the mounting channel; the outer end of the movable block is a free end; and an elastic component is arranged between the innerend of the movable block and the bottom of the mounting channel. When the optical module body is separated from the housing, the free end of the movable block extends into a cavity; the inner end ofthe movable block is connected with a tension rope; one end of the tension rope extends into the heat dissipating portion and is fixedly connected with the rod surface of a first movable rod, whereinthe rod surface of the first movable rod is adjacent to the end surface of the first movable rod; the first movable rod is hinged to the upper surface of the heat dissipating portion; the first movable rod is fixedly connected with fins; fin grooves are correspondingly formed in the heat dissipating portion; and the tension rope is connected with the first movable rod in such a manner that an angle between the tangent of the fixed joint of the tension rope and the first movable rod on the circular cross section of the first movable rod and the fins ranges from 90 to 180 degrees. The heat dissipation structure of the 25G optical module of the invention is simple and reasonable, and can effectively meet the daily heat dissipation requirements of the optical module.

Description

Technical field [0001] The invention belongs to the field of electronic communication equipment, and specifically relates to a 25G optical module. Background technique [0002] As the bandwidth of the optical communication field continues to increase, the bandwidth of the optical module is also upgraded. In response to the market's demand for high-bandwidth and high-speed data transmission, module design is increasingly moving towards miniaturization and high density. The increase in the speed of the optical module is generally accompanied by the increase in the power. As the power of the optical module increases, the volume heat density also increases, resulting in an increase in the operating temperature of the optical module, and the temperature-sensitive electro-optical / photoelectric conversion components in the optical module and The chip performance will be greatly reduced, and even cause the entire module to fail or fail. Therefore, a more efficient heat dissipation stru...

AI Technical Summary

Problems solved by technology

The increase in the rate of the optical module is generally accompanied by the increase in power. As the power of the optical module increases, the volumetric heat density also increases, resulting in an increase in the operating temperature of the optical module. The temperature-sensitive electro-optical / photoelectric conversion components in the optical module and The performance of the chip will be greatly reduced, and even cause the entire module to fail to work or fail

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