Processing technology of 25g optical module

A processing technology, optical module technology, applied in the coupling of optical waveguides, optics, light guides, etc., can solve the problems of reduced chip performance, complex processing, increased volume heat density, etc., to optimize processing steps, increase heat dissipation area, The effect of improving heat dissipation efficiency

Active Publication Date: 2020-04-24
HUANGSHAN OPTORAY COMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The increase in the rate of the optical module is generally accompanied by the increase in power. As the power of the optical module increases, the volumetric heat density also increases, resulting in an increase in the operating temperature of the optical module. The temperature-sensitive electro-optical / photoelectric conversion components in the optical module and The performance of the chip will be greatly reduced, and even cause the entire module to fail to work or fail
In addition, 25G optical modules with efficient heat dissipation structure often have problems such as complicated processing and unreasonable processing technology settings.

Method used

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  • Processing technology of 25g optical module
  • Processing technology of 25g optical module
  • Processing technology of 25g optical module

Examples

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Embodiment Construction

[0046] In each drawing, the optical module main body 10 is inserted into the housing 20 as the working state, and the optical module main body 10 is not inserted into the housing 20 as the non-operating state.

[0047] Such as figure 1 As shown, a 25G optical module includes an optical module main body 10 and an opening at one end, and a housing 20 for inserting the optical module main body 10. The optical module main body 10 can be socketed inside the housing 20 or not. , placed alone.

[0048] Such as Figure 2-5 As shown, the housing 20 includes a base 21 with a cavity inside, and the cavity allows the optical module main body 10 to enter and exit. A heat dissipation portion 22 is disposed above the base portion 21 . The base portion 21 and the heat dissipation portion 22 are actually a whole, and are divided into two parts for convenience of description.

[0049] An installation channel is provided on at least one side wall near the opening of the base 21 . A movable ...

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Abstract

The invention belongs to the field of electronic communication equipment, and relates to a processing technology of a 25G optical module. According to the specific technical schemes of the invention,the processing technology of the 25G optical module includes the following specific steps that: an optical module main body and a housing are prepared, an opening is formed at one end of the housing,and a cavity is machined inwards along the opening; a mounting passage is defined in the side wall of at least one side of the housing, and an elastic member is installed at the bottom of the mountingpassage, and a movable block is fixed at one end of the elastic member, when the elastic member is in a natural state, the outer end of the movable block extends into the cavity from the mounting passage; the inner end of the movable block is fixedly connected with a pull rope, the pull rope passes through a preset through hole at the top of the housing so as to be fixedly connected with the rodsurface of a first movable rod, the first movable rod is fixedly connected with fins and is hinged onto the top of the housing, fin grooves are formed in the top of the housing; and an angle between the tangential line of the fixed connection point of the pull rope on the cross section of the first movable rod and the fins ranges from 90 degrees to 180 degrees. The processing technology by the invention has the advantages of simplicity and reasonability, and can effectively meet the daily processing requirements of optical modules.

Description

technical field [0001] The invention belongs to the field of electronic communication equipment, and in particular relates to a processing technology of a 25G optical module. Background technique [0002] As the bandwidth in the field of optical communication continues to increase, the bandwidth of optical modules has also been upgraded. In response to the market's demand for high-bandwidth and high-speed data transmission, module design is increasingly developing in the direction of miniaturization and high density. The increase in the rate of the optical module is generally accompanied by the increase in power. As the power of the optical module increases, the volumetric heat density also increases, resulting in an increase in the operating temperature of the optical module. The temperature-sensitive electro-optical / photoelectric conversion components in the optical module and The performance of the chip will be greatly reduced, and even cause the entire module to fail to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B6/42H05K7/20C09D163/00C09D7/61
CPCC08K2003/2248C08K2003/2262C08K2003/2268C09D7/61C09D7/70C09D163/00G02B6/4256G02B6/4269H05K7/20418H05K7/20427C08K3/22C08K7/28
Inventor 汪洋朱汝俊吴海峰
Owner HUANGSHAN OPTORAY COMM
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