Modified mineral-microorganism coupled water purifying material and preparation method thereof
A microbial and modified technology, applied in the field of water purification materials, can solve problems such as short life, easy to block when used, and control water quality rebound, and achieve the effect of facilitating adsorption and precipitation, promoting mineralization process, and increasing carrier density
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Embodiment 1-8
[0043] Table 2 embodiment 1-8 carrier material A component, carrier material B component, carrier material C component specific composition
[0044]
Embodiment 1
[0046] Such as figure 1 As shown, the preparation method of the modified mineral-microorganism coupling water purification material provided by the invention, the steps are:
[0047] (1) Carrier material pretreatment
[0048] Mix 81 parts of carrier material A component, 16 parts of carrier material B component, and 6 parts of carrier material C component in parts by mass to form a carrier material, carrier material A component, carrier material B component, and carrier material C group The particle size is ≤200 mesh, and the specific composition is shown in Table 2. Put the carrier material in 1mol / L dilute sulfuric acid solution and shake for 0.5h to carry out pickling and etching, and put the carrier material after pickling and etching into the rotary furnace Carry out roasting and ablation, the roasting temperature is 500°C, and the roasting time is 2h;
[0049] (2) Carrier material modification treatment
[0050] 2.1) Add water to the carrier material treated in step (...
Embodiment 2
[0058] Such as figure 1 As shown, the preparation method of the modified mineral-microorganism coupling water purification material provided by the invention, the steps are:
[0059] (1) Carrier material pretreatment
[0060] Mix 76 parts of the carrier material A component, 15 parts of the carrier material B component, and 6 parts of the carrier material C component in parts by mass to form a carrier material, the carrier material A component, the carrier material B component, and the carrier material C group The particle size is ≤200 mesh and the specific composition is shown in Table 2. The carrier material is placed in a 1.5mol / L dilute sulfuric acid solution and shaken for 1 hour to carry out pickling and etching, and the carrier material after pickling and etching is placed in a rotary furnace for Baking ablation, the firing temperature is 600°C, and the firing time is 1.5h;
[0061] (2) Carrier material modification treatment
[0062] 2.1) Add water to the carrier ma...
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