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Special masking heat-dissipation polyimide electronic label material and preparation method thereof

A polyimide, electronic label technology, used in cooling/ventilation/heating transformation, non-polymer adhesive additives, film/flake adhesives, etc. Problems such as scalding, etc., to achieve the effects of good bonding firmness, excellent heat dissipation, excellent compatibility and dispersibility

Inactive Publication Date: 2019-02-12
深圳深汕特别合作区昌茂粘胶新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the past electronics industry, ordinary mobile phones, computers and other internal structure labels usually do not have good heat dissipation, and electronic products will become very hot when charging or using for a long time

Method used

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  • Special masking heat-dissipation polyimide electronic label material and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A shielding special heat-dissipating polyimide electronic label material, which includes a polyimide film, a black organic silica gel water layer, and a polyester film release backing paper from top to bottom; the raw material of the black organic silica gel water layer includes graphite olefin, nano-silicon carbide, silicone adhesive, ethyl acetate, the mass ratio is 12.5:2.5:62.5:27.5.

[0020] A method for preparing a shielding special heat-dissipating polyimide electronic label material, characterized in that it comprises the following steps:

[0021] (1) Grind the graphene until the particle diameter is less than <75 nanometers, add the solution to the silicone adhesive, and add nano-silicon carbide and ethyl acetate to the silicone mixed adhesive in sequence according to the formula ratio, and carry out 20-25 Disperse and stir for 1 minute until it turns black;

[0022] (2) The corresponding parameters are set for the scraper coater, and the above-mentioned mixed...

Embodiment 2

[0024] A shielding special heat-dissipating polyimide electronic label material, which includes a polyimide film, a black organic silica gel water layer, and a polyester film release backing paper from top to bottom; the raw material of the black organic silica gel water layer includes graphite olefin, nano-silicon carbide, silicone adhesive, ethyl acetate, the mass ratio is 10:3:60:30. The glue layer is poly-mixed silicone adhesive.

[0025] A method for preparing a shielding special heat-dissipating polyimide electronic label material, characterized in that it comprises the following steps:

[0026] (1) Grind the graphene until the particle diameter is less than <75 nanometers, add the solution to the silicone adhesive, and add nano-silicon carbide and ethyl acetate to the silicone mixed adhesive in sequence according to the formula ratio, and carry out 20-25 Disperse and stir for 1 minute until it turns black;

[0027] (2) The corresponding parameters are set for the scra...

Embodiment 3

[0029] A shielding special heat-dissipating polyimide electronic label material, which includes a polyimide film, a black organic silica gel water layer, and a polyester film release backing paper from top to bottom; the raw material of the black organic silica gel water layer includes graphite olefin, nano-silicon carbide, silicone adhesive, ethyl acetate, the mass ratio is 15:2:65:25. The glue layer is poly-mixed silicone adhesive.

[0030] A method for preparing a shielding special heat-dissipating polyimide electronic label material, characterized in that it comprises the following steps:

[0031] (1) Grind the graphene until the particle diameter is less than <75 nanometers, add the solution to the silicone adhesive, and add nano-silicon carbide and ethyl acetate to the silicone mixed adhesive in sequence according to the formula ratio, and carry out 20-25 Disperse and stir for 1 minute until it turns black;

[0032] (2) The corresponding parameters are set for the scra...

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Abstract

The invention provides a special masking heat-dissipation polyimide electronic label material. The material comprises a polyimide film, a black organic silicone glue layer and polyester film releasing-type base paper from top to bottom; the black silicone glue layer comprises graphene, nanometer silicon carbide, an organic silicone adhesive and ethyl acetate according to a mass ratio of (10-15):(2-3):(60-65):(25-30). The provided special masking heat-dissipation self-adhesive electronic label material has good masking property and can achieve a masking effect higher than 95% and assist electronic and electrical products in heat dissipation, and the heat dissipation performance is improved by 30%. The material is mainly used for electronics and battery product information labels.

Description

technical field [0001] The invention belongs to the field of glue materials, and in particular relates to a shielding special heat-dissipating polyimide electronic label material and a preparation method thereof. Background technique [0002] With the entry of the electronic age, the demand for the electronic market is increasing, and the requirements for electronic products are emerging in an endless stream. Among them, under a long-term use of electronic products, there is a requirement for heat dissipation. Many of the current market cannot be well perfected. Electronic equipment is prone to heat, poor heat dissipation, and even explosion. Graphene has good heat dissipation, which is found in most electronic products. This invention mainly changes the structure of graphene and adds it to the silicone adhesive. Through a uniform coating process, the heat dissipation can reach Balanced, large-area heat dissipation, thereby reducing heat generation. [0003] In the past el...

Claims

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Application Information

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IPC IPC(8): G09F3/02H05K7/20C09J7/30C09J7/25C09J183/04C09J11/04
CPCC08K2201/011C09J11/04C09J183/04C09J2479/086C09J7/25C09J7/30G09F3/02H05K7/20C08K3/042C08K3/34
Inventor 王益刚贺凌黄伟
Owner 深圳深汕特别合作区昌茂粘胶新材料有限公司
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