A kind of method that adopts printing technology to make gpp chip

Abstract

The invention relates to a method for manufacturing a GPP chip by using a printing process. The preparation steps include silicon chip pretreatment, diffusion texturing, glass passivation printing and drawing, metallization and test sorting, wherein the diffusion step adopts silicon-phosphorus one-time negative pressure diffusion, Wet texturing is adopted, and the glass passivation process uses printing to coat the protective layer and the glass paddle, which simplifies the glass passivation process and increases the preparation rate. Compared with traditional methods, the production process of GPP chips produced by printing process is large-scale, automated, informatized, and less humanized; GPP chip products have low production cost, high quality, high consistency, and good market compatibility; printing process has high efficiency and high precision , to replace the coating, coating, electrophoresis and other processes in the existing process, to achieve automated production with fewer people, improve product consistency, and reduce environmental protection and safety risks.

Description

technical field [0001] The invention belongs to the technical field of GPP chips, and in particular relates to a method for manufacturing GPP chips by using a printing process. Background technique [0002] With the development of semiconductor technology, the requirements for passivation of semiconductor surfaces are getting higher and higher. As a passivation material, it should have good electrical properties, reliability, good chemical stability, operability and economy. According to the above requirements, special glass for semiconductor passivation has been applied in the semiconductor industry as an ideal semiconductor passivation material. Chips made of special glass for semiconductor passivation are called glass passivation process chips (GPP chips). GPP chips are widely used in various switching power supplies, regulated power supplies, computer power supplies, air conditioners, stereos, copiers, fax machines, cordless phones, induction cookers, microwave ovens, m...

AI Technical Summary

Problems solved by technology

[0003] There are three main processes used in the industry to produce GPP chips: knife-scraping process, electrophoresis process, and photoresist glass process. Among these three processes, the knife-scraping GPP process is simple and low in cost. There is no oxide film protection on the chemical glass, the solder is easy to flow to the glass, the reliability will be reduced, and it is easy to fail during application; the sharp corners of the electrophoresis process groove are protected by passivated glass, and the reliability is relatively high, but a large amount of acetone is required in production , there are potential safety hazards, and the relative cost is relatively high; the photoresist glass method adopts 3 layers of passivation protection (SIPOS, glass, silicon dioxide), the reverse voltage is higher, and the resistivity range of the silicon wafer is wider and the reliability is high, but Three times of photolithography are required in production, and the production cost is relatively high