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Cutter for processing sputtering face of target material and processing method

A processing method and sputtering surface technology, which are applied to lathe cutting tools, manufacturing tools, metal processing equipment, etc., can solve problems such as difficulty in meeting product quality requirements and poor texture quality, and achieve improved roughness, improved quality, The effect of improving uniformity

Active Publication Date: 2019-01-25
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the quality of the texture formed on the sputtering surface of the target by the existing technology is poor, and it is difficult to meet the quality requirements of the product

Method used

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  • Cutter for processing sputtering face of target material and processing method
  • Cutter for processing sputtering face of target material and processing method
  • Cutter for processing sputtering face of target material and processing method

Examples

Experimental program
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Embodiment Construction

[0043] It can be seen from the background art that the quality of the texture formed on the sputtering surface of the target in the prior art is poor, and it is difficult to meet the quality requirements of the product.

[0044] In the process of machining, disc cutters are usually used for surface treatment on the surface to be processed, so as to form texture on the surface to be processed. However, the texture formed on the sputtering surface of the target by using a disc cutter is often difficult to meet the quality requirements of the sputtering surface of the target.

[0045] After research, it is found that since the disc cutter usually includes multiple cutter heads located in the same plane, when the disc cutter is used to process the sputtering surface of the target, multiple cutter heads will simultaneously cut the sputtering surface of the target, each The cutter head will form an independent pattern; while the disc cutter will not only move the entire blade body i...

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Abstract

The invention relates to a cutter for processing a sputtering face of a target material and a processing method. The cutter comprises a cutter rod and a cutter head. The cutter rod is provided with afirst face and a second face which are oppositely arranged; the cutter head is located on the first face and fixed to one end of the cutter rod in the extension direction and comprises a fixing base and a blade, the fixing base is fixedly connected with the cutter rod, the blade is connected with the fixing base, and an edge of the blade protrudes out of the surface of the fixing base. When the cutter is used for processing a to-be-processed surface, a continuous grain can only be formed on the to-be-processed surface, and the formed grain cannot cross; through formation of the continuous anduncrossed grain, the evenness of the sputtering grain of the target material can be effectively improved, the quality of the grain of the sputtering face of the target material is conveniently improved, the roughness of the sputtering face of the target material is improved, and accordingly the formed product meets the quality demand.

Description

technical field [0001] The invention relates to the field of target material processing, in particular to a tool and a processing method for processing a sputtering surface of a target material. Background technique [0002] Magnetron sputtering is a coating process that uses charged particles to bombard the target, causing the target atoms to overflow from the surface and evenly deposit on the substrate. Magnetron sputtering has the advantages of high sputtering rate, low substrate temperature, good bonding force between substrate and film, and excellent film uniformity. Magnetron sputtering technology has been widely used in the manufacturing process of electronic and information industries such as integrated circuits, information storage devices, liquid crystal displays, laser memories, and electronic control devices. [0003] With the rapid development of the electronics industry, for example, in the manufacturing process of integrated circuits, the size of chip substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23B27/00B23B29/02B23B29/03
CPCB23B27/00B23B29/02B23B29/03
Inventor 姚力军潘杰相原俊夫王学泽罗明浩钱百峰
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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