Epoxy resin composite Sn-Bi lead-free soldering paste

An epoxy resin, lead-free solder paste technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of increased production costs, prolonged solder smelting process, difficult control, etc. Shear strength, effect of improving wetting and spreading properties

Inactive Publication Date: 2019-01-11
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the above two methods have their own advantages and disadvantages. The alloying method prolongs the solder smelting process, which leads to increased production costs and the burning loss and segregation of trace alloy elements are difficult to control; the preparation process of the particle reinforcement method is complicated, and the nanoparticles are easy to segregate. The comprehensive properties of composite solder still cannot meet the growing and rapidly developing needs of new electronic product manufacturing

Method used

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  • Epoxy resin composite Sn-Bi lead-free soldering paste
  • Epoxy resin composite Sn-Bi lead-free soldering paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] An epoxy resin composite Sn-Bi lead-free solder paste is characterized in that its composition is a mixture of 3% epoxy resin, curing agent and accelerator by mass percentage ratio (each component accounts for the composition mass percentage The proportion is epoxy resin: curing agent: accelerator = 100: 8: 1), and the balance is commercially available Sn-Bi solder paste (specifically EcoLM-C10X). The epoxy resin is a combination of NPEL-127H type bisphenol A and E51 type bisphenol A in a mass ratio of 1:1; the curing agent is a combination of m-phenylenediamine and dicyandiamide in a mass ratio of 1:2; the accelerator It is the combination of SH-A80 and SH-A150 according to the mass ratio of 1:3. In the commercially available Sn-Bi solder paste used, the Sn-Bi alloy powder accounts for 85% of the commercially available Sn-Bi solder paste, and the balance is commercially available flux (specifically ECO Flux 823). For the Sn-Bi alloy powder in the commercially availabl...

Embodiment 2

[0028] An epoxy resin composite Sn-Bi lead-free solder paste is characterized in that its composition is a mixture of 8% epoxy resin, curing agent and accelerator by mass percentage proportioning (each component accounts for the composition mass percentage The ratio is epoxy resin: curing agent: accelerator = 100: 30: 10), and the balance is commercially available Sn-Bi solder paste (not specifically EcoLM-C10X). The epoxy resin is a combination of E44 type bisphenol A and E51 type bisphenol A in a mass ratio of 2:1; the curing agent is a combination of m-phenylenediamine and p-phenylenediamine in a mass ratio of 1:4; the accelerator is SH- The combination of A90, SH-A100, and SH-A150 is in a mass ratio of 1:2:1.5. The Sn-Bi alloy powder in the commercially available Sn-Bi solder paste used accounts for 95% of the commercially available Sn-Bi solder paste, and the balance is commercially available flux (specifically ECO Flux823). In the Sn-Bi alloy powder in the commercially ...

Embodiment 3

[0031] An epoxy resin composite Sn-Bi lead-free solder paste is characterized in that its composition is a mixture of 6% epoxy resin, curing agent and accelerator by mass percentage ratio (each component accounts for the composition mass percentage The proportion is epoxy resin: curing agent: accelerator = 100: 10: 3), and the balance is commercially available Sn-Bi solder paste (specifically EcoLM-C10X). The epoxy resin is NPEL-127H type bisphenol A; the curing agent is m-phenylenediamine; the accelerator is SH-A150. In the commercially available Sn-Bi solder paste used, the Sn-Bi alloy powder accounts for 90% of the commercially available Sn-Bi solder paste, and the balance is commercially available flux (specifically ECO Flux823). In the Sn-Bi alloy powder in the commercially available Sn-Bi lead-free solder paste, the Bi element accounts for 58% of the alloy powder, P accounts for 0.02%, Ni accounts for 0.05%, and the balance is Sn. The particle diameter of the alloy powd...

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Abstract

The invention provides an epoxy resin composite Sn-Bi lead-free soldering paste. The soldering paste is characterized by comprising the following components of, in percentage by mass, 3%-8% of epoxy resin, a curing agent, an accelerant (the ratio of the epoxy resin to the curing agent to the accelerant is 100:8-30:1-10), and the balance a commercially available Sn-Bi soldering paste. The epoxy resin is a combination of one or any two or three among Npel-127 H type bisphenol A, E44 type bisphenol A, and E51 type bisphenol A in any proportion; the curing agent is a combination of one or any twoor three among m-phenylenediamine, p-phenylenediamine, and dicyandiamide in any proportion; and the accelerant is a combination of one or any two or three of SH-A80, SH-A85, SH-A90, SH-A95, SH-A100, SH-A150 in any proportion. The composite Sn-Bi lead-free soldering paste has good wetting and spreading performances, the shear strength of a soldering head can be remarkably improved, and the soldering paste can be used for reflow soldering of components in the electronic industry.

Description

technical field [0001] The invention relates to an epoxy resin composite Sn-Bi lead-free solder paste, which belongs to brazing materials in the field of metal materials and metallurgy. It is mainly used for the assembly and packaging of components in the electronic industry. It is a lead-free solder with good brazing performance (such as wetting and spreading performance) and excellent mechanical properties of solder joints (brazing seams). Background technique [0002] With the continuous advancement of electronic packaging technology and the acceleration of the upgrading of electronic products, the size of micro-solder joints required in the field of micro-nano connections is also getting smaller and smaller. At the same time, the loads of force, electricity and heat that welding parts need to bear However, it is increasing day by day, and higher and higher requirements are put forward for the reliability and brazing efficiency of brazed joints. Among numerous lead-free ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363B23K35/14
CPCB23K35/025B23K35/264B23K35/3613B23K35/362
Inventor 刘露薛鹏薛松柏龙伟民钟素娟
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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