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Adhesive having high glass-transition temperature and flexible copper-coated plate

A flexible copper clad laminate, transition temperature technology, used in adhesives, adhesive additives, polymer adhesive additives, etc., can solve the problem of heat resistance, chemical resistance, dimensional stability, long-term reliability can not meet the requirements of use, Problems such as limited heat resistance and low glass transition temperature, to achieve the effect of low cost, strong peeling performance, and excellent heat resistance

Inactive Publication Date: 2018-12-28
南昌正业科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These two types of adhesives have a low glass transition temperature and limited heat resistance
With the rapid development of the electronics industry, electronic products are further miniaturized, lightweight, and assembled with high density. Conventional adhesives cannot meet the requirements in terms of heat resistance, chemical resistance, dimensional stability, and long-term reliability. Therefore, Need to develop heat-resistant adhesives with high glass transition temperature (Tg)

Method used

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  • Adhesive having high glass-transition temperature and flexible copper-coated plate
  • Adhesive having high glass-transition temperature and flexible copper-coated plate
  • Adhesive having high glass-transition temperature and flexible copper-coated plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] (1) Adhesive formula:

[0063] Polyetherimide resin (purchased from Saudi Basic Industries Corporation, SABIC): 20 parts by mass; HP-4700: 1 part by mass; JD-919: 8 parts by mass; DOPO: 3 parts by mass; SPH-100: 4 parts by mass ; CTBN: 2 parts by mass; 4,4'-DDS: 4 parts by mass; 2-ethyl-4 methylimidazole: 0.3 parts by mass; KBM-603: 0.3 parts by mass; solvent (dimethylformamide): 60 parts by mass.

[0064] (2) Preparation method of flexible copper clad laminate:

[0065] The adhesive prepared by the above formula is coated on the polyimide film, dried in an oven at 100°C for 5 minutes, and then rolled and laminated with copper foil at 130°C to obtain a semi-cured composition;

[0066] The semi-cured composition was post-cured at 180° C. to obtain a single-sided flexible copper clad laminate.

[0067] In the flexible copper clad laminate, the adhesive layer has a thickness of 15 microns; the polyimide film has a thickness of 25 microns; and the copper foil is an elect...

Embodiment 2

[0081] (1) Adhesive formula:

[0082] Polyetherimide resin (purchased from Saudi Basic Industries Corporation, SABIC): 20 parts by mass; HP-4700: 3 parts by mass; XD-1000: 6 parts by mass; DOPO: 3.5 parts by mass; SPH-100: 3.5 parts by mass ; CTBN: 2.1 parts by mass; 4,4'-DDS: 3.8 parts by mass; 2-ethyl-4 methylimidazole: 0.32 parts by mass; KBM-603: 0.28 parts by mass; solvent (dimethylformamide): 60 parts by mass.

[0083] (2) According to the preparation method of Example 1, a flexible copper clad laminate was prepared.

[0084] (3) Carry out performance test to described flexible copper-clad laminate according to the test method of embodiment 1:

[0085] Table 2 Performance measurement results of flexible copper clad laminates

[0086]

Embodiment 3

[0088] (1) Adhesive formula:

[0089] Polyamide-imide resin (Vylomax, purchased from Japan Toyobo Co., Ltd.): 21 parts by mass; HP-4700: 2 parts by mass; NC-3000: 7 parts by mass; DOPO: 3 parts by mass; SPH-100: 4.1 parts by mass parts by mass; CTBN: 2.2 parts by mass; 4,4'-DDS: 4 parts by mass; 2-ethyl-4 methylimidazole: 0.31 parts by mass; KBM-603: 0.31 parts by mass; solvent (butanone): 60 parts by mass .

[0090] (2) According to the preparation method of Example 1, a flexible copper clad laminate was prepared.

[0091] (3) Carry out performance test to described flexible copper-clad laminate according to the test method of embodiment 1:

[0092] Table 3 Performance measurement results of flexible copper clad laminates

[0093]

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Abstract

The invention provides an adhesive having high glass-transition temperature. The adhesive has very high glass-transition temperature (Tg) 170 DEG C, and the heat-resistant performance is superior to those of epoxy system adhesive and acrylic ester system adhesive. A flexible copper-coated plate prepared by using the adhesive has the excellent heat-resistant performance, bonding performance, flameresistance performance and weather-proof performance and can be applied to the field of high-end circuit boards, such as automobiles, G-series high-speed trains, spaceflight and war industry.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to an adhesive with a high glass transition temperature and a flexible copper-clad board. Background technique [0002] Flexible copper clad laminate (FCCL) is mainly a kind of copper clad laminate with good flexibility made of high temperature resistant polyimide (PI) as the insulating base film, because it is light, thin, small in size and flexible It is widely used in mobile phones, digital cameras, digital video cameras, notebook computers, flat-panel TVs, office automation equipment, automotive electronics, instrumentation, medical machinery, aerospace, military and other fields. [0003] In flexible copper clad laminates, the adhesive used to bond PI film and copper foil is a key factor determining the performance of copper clad laminates. At present, the adhesives used for flexible copper clad laminates are mostly epoxy resin adhesives and acrylate adhesives. ...

Claims

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Application Information

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IPC IPC(8): C09J179/08C09J163/00C09J11/06C09J11/08H05K1/03B32B15/08B32B15/20B32B27/28B32B7/12
CPCB32B7/12B32B15/08B32B15/20B32B27/281C08L2201/08C08L2205/03C09J11/06C09J11/08C09J179/08C09J179/085H05K1/0353C08L63/00C08L13/00C08K5/5313C08K5/5435
Inventor 苏亚军袁庆宇苏华弟吴飞龙桂礼家
Owner 南昌正业科技有限公司
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