Semi-solidified grinding disk for semiconductor substrate grinding, and preparation method and application thereof

A technology of grinding discs and semiconductors, which is applied in the direction of grinding tools, grinding/polishing equipment, grinding devices, etc., can solve the problems of difficulty in ensuring the surface shape accuracy of substrates, deformation of grinding discs, etc., and achieve improved surface shape accuracy, rigidity, The effect of good surface quality

Pending Publication Date: 2018-12-21
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the semi-consolidated abrasive grinding disc is relatively soft, the grinding disc will undergo large deformation due to the application of grinding pressure during the grinding process, making it difficult to guarantee the surface shape accuracy of the substrate.

Method used

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  • Semi-solidified grinding disk for semiconductor substrate grinding, and preparation method and application thereof
  • Semi-solidified grinding disk for semiconductor substrate grinding, and preparation method and application thereof
  • Semi-solidified grinding disk for semiconductor substrate grinding, and preparation method and application thereof

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Experimental program
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Effect test

Embodiment 1

[0040] Please check figure 1 , which is a semi-consolidated grinding disc for semiconductor substrate grinding in this embodiment, including a base disc 1 and a number of grinding discs 2 evenly arranged on the base disc;

[0041] Please refer to figure 2 , the base plate 1 is circular, with a circular mounting hole 11 in the center, which is convenient to connect with the processing machine tool; the base plate 1 is also provided with a number of uniformly distributed grinding fluid holes 12 with a diameter of about 8mm, which are used to introduce grinding liquid. A plurality of grinding discs 2 are regularly arranged on the surface of the base plate 1 in a lattice shape, and the upper surfaces of the grinding discs 2 jointly form a grinding working surface, and there is a gap with a width of 2 mm between adjacent grinding discs 2 to form a flow channel 23, such as Figure 4 shown.

[0042] Please refer to image 3 , the grinding plate 2 is in the shape of a square sheet...

Embodiment 2

[0058] The semi-consolidated grinding disc used for grinding semiconductor substrates in this embodiment includes a base disc and several grinding discs evenly arranged on the base disc;

[0059] The base plate is circular, with a circular mounting hole in the center, which is convenient for connection with the processing machine tool; there are also a number of grinding liquid holes with a diameter of about 8mm on the base plate, which are used to introduce the grinding liquid. A number of grinding discs are regularly arranged on the surface of the base plate in a grid pattern, and the upper surfaces of the grinding discs jointly form a grinding working surface, and there is a gap with a width of 2 mm between adjacent grinding discs to form a flow channel.

[0060] The grinding disc is in the shape of a square sheet, including a skeleton and a semi-consolidated grinding medium containing abrasive grains; the skeleton is made of a hard epoxy resin material, and a number of circ...

Embodiment 3

[0068] The semi-consolidated grinding disc used for grinding semiconductor substrates in this embodiment includes a base disc and several grinding discs evenly arranged on the base disc;

[0069] The base plate is circular, with a circular mounting hole in the center, which is convenient for connection with the processing machine tool; there are also a number of grinding liquid holes with a diameter of about 8mm on the base plate, which are used to introduce the grinding liquid. A number of grinding discs are regularly arranged on the surface of the base plate in a grid pattern, and the upper surfaces of the grinding discs jointly form a grinding working surface, and there is a gap with a width of 2 mm between adjacent grinding discs to form a flow channel.

[0070] The grinding disc is in the shape of a square sheet, including a skeleton and a semi-consolidated grinding medium containing abrasive grains; the skeleton is made of a hard epoxy resin material, and a number of circ...

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Abstract

The invention discloses a semi-solidified grinding disk for semiconductor substrate grinding, and a preparation method and application thereof. The semi-solidified grinding disk comprises a base diskand a plurality of grinding slices. Each grinding slice comprises a skeleton and a semi-solidified grinding medium containing abrasive particles, wherein the skeleton is uniformly provided with a plurality of holes penetrating through the upper and lower surfaces of the skeleton, and the holes are filled with the semi-solidified grinding medium containing the abrasive particles; the hardness of the skeleton is higher than that of the semi-solidified grinding medium. The lower surfaces of the grinding slices are fixedly connected to the base disk. The upper surfaces of the grinding slices jointly form a grinding working surface. Flow channels are formed between the adjacent grinding slices. The novel structure semi-solidified grinding disk for semiconductor substrate grinding can achieve the good surface quality and high grinding efficiency, meanwhile, can improve the surface figure accuracy of substrates and can also be used for precise grinding machining of semiconductor substrate parts having the high requirement for the surface figure accuracy.

Description

technical field [0001] The invention relates to the field of semiconductor material processing, in particular to a semi-solidified grinding disc used for grinding semiconductor substrates, a preparation method and application thereof. Background technique [0002] In the preparation process of optoelectronic semiconductor substrates, the substrate parts not only require good surface quality, but also high surface shape accuracy. At present, the preparation of the substrate mainly includes processes such as slicing, flattening and polishing. In the leveling process, the cut marks generated during the wire cutting process are mainly removed by free abrasive grinding, and a relatively flat surface is obtained, which provides a good foundation for subsequent polishing. However, in the process of planarizing substrates with free abrasives, due to the uneven distribution of abrasives and the uncontrollability of abrasive trajectory, it is difficult to guarantee the surface shape ...

Claims

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Application Information

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IPC IPC(8): B24B37/14B24B37/16B24D18/00
CPCB24B37/14B24B37/16B24D18/0009
Inventor 于怡青胡中伟陆静徐西鹏朱泽朋赵欢
Owner HUAQIAO UNIVERSITY
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