A processing method for improving three-dimensional micro-nano structures based on composite scanning

Abstract

The invention discloses a method for improving three-dimensional micro-nano structure based on composite scanning. The method includes such steps as coating photoresist on substrate; Adjusting the light signal emitted from the laser light source according to the exposure demand of the photoresist; passing the adjusted laser beam is firstly through a two-dimensional vibrating mirror, and then focusingon a designated position in the photoresist through an objective lens; dividing the three-dimensional structure model to be processed into a plurality of two-dimensional planes along the longitudinal axis direction; importing the spatial coordinate information of all the points which are combined into a three-dimensional model structure into the control system of the machining platform. The micro-moving platform moves under the preset motion trajectory of the control system, and the photoresist is exposed according to the motion trajectory of the platform under the irradiation of the laserbeam. While the micro-moving platform moves along the preset trajectory, the two-dimensional vibrating mirror vibrates in another vibration mode, that is, the exposure trajectory of the light spot focused in the photoresist is composed of the superposition of the two-dimensional vibrating mirror trajectory and the three-dimensional micro-nano-moving platform trajectory.

Description

technical field [0001] The invention relates to the technical field of three-dimensional micro-nano structure processing, in particular to a processing method for improving three-dimensional micro-nano structures based on composite scanning. Background technique [0002] As an important advanced manufacturing method of three-dimensional micro-nano structure, femtosecond laser processing technology has been widely used in many industrial processing and manufacturing fields. Traditionally, the method of processing materials based on a focused continuous laser beam, on the one hand, is limited by the theoretical basis of the optical diffraction limit, and the processing resolution is suppressed at the micron and submicron scales, making it difficult to process ultra-high-precision micro-nano structures at the nanoscale. On the one hand, limited by the single-photon interaction mechanism, the processed object is usually limited to a two-dimensional planar structure. In recent y...

AI Technical Summary

Problems solved by technology

Usually, the three-dimensional piezoelectric displacement platform with nanoscale repeat positioning accuracy has a relatively large inertia and a slow response time of more than 10ms, so it takes a long time to prepare the micro-nano structure and the size error is large

Although the moment of inertia of the two-dimensional galvanometer is small and the response time is fast, the scanning of the two-dimensional galvanometer is limited to processing high-precision structures in the two-dimensional plane, and it is difficult to process complex three-dimensional structures.

Therefore, simply using the above two scanning methods to process three-dimensional micro-nano structures has been difficult to meet the rapid development of high-precision micro-nano diffractive optical device manufacturing and integrated optoelectronic devices in terms of processing time, dimensional accuracy of formed devices, and surface smoothness control. Corresponding requirements in application fields such as preparation and biomedical device processing

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