On-chip test DC probe card

Abstract

The invention discloses an on-chip test DC probe card, and aims at overcoming the defect a traditional DC probe card has a parasitic inductance effect and meeting on-chip test requirements of different microwave monolithic integrated circuits. The on-chip test DC probe card comprises an annular dielectric substrate, DC feed and grounding probes are welded to the upper surface of the substrate, a capacitor is connected to the probes, the DC feed probe is connected with the upper electrode of the capacitor, the grounding probe is connected with the lower electrode of the capacitor, the feed probe is connected to a DC voltage block of a tested chip via the upper electrode of the capacitor, and the grounding problem is connected to a grounding voltage block of the tested chip via the lower electrode of the capacitor. Thus, traditional influence of the DC probe on a test result of the microwave chip is eliminated, and the test performance is improved.

Description

technical field [0001] The invention relates to the field of microwave on-chip testing, in particular to a DC probe card for on-chip testing. Background technique [0002] Microwave on-chip testing is to perform a functional test on the bare chip with a probe before the microwave monolithic integrated circuit is packaged, to screen out defective products, and then proceed to the subsequent packaging project. In short, the on-wafer test DC probe card is the interface between the test machine and the wafer. Each test component requires at least one corresponding DC probe card, and the purpose of the test is to make the wafer good after dicing. Enter the next packaging process, and avoid waste caused by continued processing of defective products. Therefore, the impact of DC probe cards on manufacturing costs and test results in integrated circuit manufacturing is very important. [0003] At present, microwave integrated circuit chips are mostly tested using various microwave ...

AI Technical Summary

Problems solved by technology

[0003] At present, microwave integrated circuit chips are mostly tested using various microwave test instruments and probe stations. The DC feed of the chip to be tested generally uses a DC probe to contact the DC feed point of the chip, but the clutter of the bias power supply is also It will be loaded on the chip under test through the bias loop, which will affect the test results of the microwave chip

It is difficult to realize the bypass capacitor with a large area inside the chip in terms of cost and process. If the DC probe is accurately modeled and the influence of the embedded DC probe on the microwave test result is removed during the test, this The method requires huge manpower and material resources, which is impractical

Especially for the test of amplifier chips, due to the parasitic effect of traditional DC probes, it is easy to cause DC oscillation of the chip under test, which often leads to failure to test

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