A kind of curing method of photosensitive resin bcb
A curing method and technology of photosensitive resin, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as device BCB failure, reduce RC time constant, improve BCB quality, and reduce the possibility of oxidative aging. Effect
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[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0025] A kind of curing method of photosensitive resin BCB, comprises the steps:
[0026] 1) Firstly, the photosensitive BCB glue is evenly spread on the surface of the epitaxial wafer by using the rotary coating method on the glue leveling machine; in the photolithography machine, the pattern on the mask plate is exposed to the epitaxial wafer by using ultraviolet exposure technology; the exposed epitaxial wafer is baked ; Then use t...
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