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A kind of curing method of photosensitive resin bcb

A curing method and technology of photosensitive resin, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as device BCB failure, reduce RC time constant, improve BCB quality, and reduce the possibility of oxidative aging. Effect

Active Publication Date: 2021-02-26
湖北光安伦芯片有限公司
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AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the defects of the prior art, and provide a new curing method for photosensitive resin BCB, which can improve the quality of photosensitive BCB glue after formation, solve the problem of device BCB related failure caused by traditional methods, and then improve the overall performance of the chip. performance

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  • A kind of curing method of photosensitive resin bcb
  • A kind of curing method of photosensitive resin bcb
  • A kind of curing method of photosensitive resin bcb

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Embodiment Construction

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] A kind of curing method of photosensitive resin BCB, comprises the steps:

[0026] 1) Firstly, the photosensitive BCB glue is evenly spread on the surface of the epitaxial wafer by using the rotary coating method on the glue leveling machine; in the photolithography machine, the pattern on the mask plate is exposed to the epitaxial wafer by using ultraviolet exposure technology; the exposed epitaxial wafer is baked ; Then use t...

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Abstract

The invention belongs to the technical field of semiconductor chip manufacturing, and specifically relates to a method for curing photosensitive resin BCB, comprising the following steps: 1) coating a photosensitive BCB glue on the surface of an epitaxial wafer, and forming a photosensitive BCB glue on the surface of the epitaxial wafer by photolithography 2) Treat the photosensitive BCB adhesive on the surface of the epitaxial wafer by plasma reactive etching; 3) Put the etched epitaxial wafer into the annealing furnace, and pass H 2 and Ar mixed gas protection, using a multi-stage temperature rise and heat preservation method from 50°C to 275°C, and kept at 275°C for 2h; 4) Then increase the amount of H 2 and Ar mixed gas flow rate, quickly lower the temperature of the annealing furnace to room temperature, stop feeding H 2 and Ar mixed gas to complete the curing. The curing method of the photosensitive resin BCB provided by the invention adopts the mode of multi-stage temperature rise and heat preservation, so that the polymerization reaction of BCB is more sufficient; and when annealing, H 2 Mixed gas with Ar replaces traditional N 2 As a protective gas, it reduces the possibility of oxidative aging and improves the quality of BCB.

Description

technical field [0001] The invention belongs to the technical field of semiconductor chip manufacturing, especially the high-speed and high-frequency chip part of high-end products, and specifically relates to a curing method of photosensitive resin BCB, which is used for making passivation layers and filling layers of chips. Background technique [0002] In the process of semiconductor chip processing, with the increase of frequency and speed, such as in the field of microelectronics processing and high-speed communication, the requirements for chip size, parasitic effect parameters, reliability, and insulation are getting higher and higher. The traditional processing passivation method can no longer meet the requirements of high-end products, and there is an urgent need for a material that can meet the processing of high-end chip products. BCB (benzocyclobutene) is a material with good performance that meets various requirements. This photosensitive photoresist has the cha...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56
CPCH01L21/56
Inventor 郭明玮刘志锋祝希许海明
Owner 湖北光安伦芯片有限公司
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