A kind of hydrocarbon polymer copper clad laminate composition

Abstract

The invention discloses a hydrocarbon polymer copper-clad laminate composition. The composition comprises, in parts by weight, 20-40 parts by weight of polybutadiene, and 15-30 parts by weight of styrene-ethylene block copolymer. , 15-25 parts by weight of polyphenylene ether, 5-10 parts by weight of crosslinking agent, 3-5 parts by weight of curing agent, and 20-40 parts by weight of inorganic filler. The copper-clad laminate made of the composition has the advantages of low dielectric constant, low dielectric loss, good heat resistance, high anti-peeling strength and the like.

Description

technical field [0001] The invention relates to a hydrocarbon polymer copper clad laminate composition. Background technique [0002] The advancement of modern information technology has brought digital circuits into the stage of high-speed information processing and high-frequency signal transmission, which puts forward higher requirements for the dielectric constant and dielectric loss of microwave dielectric circuit substrates. [0003] The technical difficulties faced by hydrocarbon polymer copper-clad laminates are low peel strength, poor heat resistance, and large thermal expansion coefficient. For example, in US5571609A, it is disclosed that the circuit substrate made of 1,2-polybutadiene resin or polyisoprene and high molecular weight butadiene-styrene copolymer as a resin matrix has low peel strength; in WO1997038564A1, it is disclosed In order to use styrene-butadiene copolymer as the resin matrix, the heat resistance of the circuit board made by adding aluminum m...

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Problems solved by technology

[0003] The technical difficulties faced by hydrocarbon polymer copper clad laminates are low peel strength, poor heat resistance, and large thermal expansion coefficient.

For example, in US5571609A, it is disclosed that the circuit substrate made of 1,2-polybutadiene resin or polyisoprene and high molecular weight butadiene-styrene copolymer as a resin matrix has low peel strength; in WO1997038564A1, it is disclosed In order to use styrene-butadiene copolymer as the resin matrix, the heat resistance of the circuit board made by adding aluminum magnesium silicate as the filler is poor; in CN101328177A, it is disclosed that polybutadiene resin and maleic anhydride grafted copolymer are used for mixing For the preparation of high-frequency circuit substrates, although the anti-peel strength has been improved, the dielectric properties have decreased

[0004] Polyphenylene ether has excellent properties such as low polarity and high heat resistance. The difficulty in its application is that polyphenylene ether with too large molecular weight has poor fluidity and is not easy to process and shape. Modified polyphenylene ether can solve the above difficulties well.

However, the molecular weight distribution of modified polyphenylene ether is not easy to control. If the molecular weight of modified polyphenylene ether is too large, the consistency of the obtained circuit substrate is poor. If the molecular weight is too small, the obtained circuit substrate has poor heat resistance.

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