Magnesium-aluminum-silicon low-thermal-expansion-coefficient microcrystalline glass material and preparation method thereof

Abstract

The invention belongs to the field of electronic ceramic materials, and particularly provides a magnesium-aluminum-silicon low-thermal-expansion-coefficient microcrystalline glass material and a preparation method thereof which are used for overcoming the problems of high sintering temperature, large thermal expansion coefficient, low bending strength, high dielectric constant, high dielectric loss and the like of an existing ceramic material. The magnesium-aluminum-silicon low-thermal-expansion-coefficient microcrystalline glass material and the preparation method thereof have the advantagesthat the prepared low-thermal-expansion-coefficient microcrystalline glass has low thermal expansion coefficient (1.0-2.0*10<-6> per DEG C), high bending strength (150-200 MPa), low dielectric constant (5.0-5.5 @1 MHz), low dielectric loss (1.5-3.5*10<-3> @1 MHz) and reliable insulation, thereby satisfying the requirements of an LTCC electronic package substrate material; the magnesium-aluminum-silicon low-thermal-expansion-coefficient microcrystalline glass material can achieve low-temperature sintering at 900-950 DEG C, the process is simple, the stability is high, the production cost is low, and the magnesium-aluminum-silicon low-thermal-expansion-coefficient microcrystalline glass material is suitable for industrial mass production.

Description

technical field [0001] The invention belongs to the field of electronic ceramic materials, and relates to a magnesium-aluminum-silicon-based low thermal expansion coefficient glass-ceramic material and a preparation method thereof; the material is suitable for electronic packaging, especially for ultra-large-scale integrated circuits. Background technique [0002] The rapid development of information technology promotes the continuous development of integrated circuit systems towards high density, ultra-large scale and multi-functionalization. The rapid improvement of semiconductor chip performance also makes electronic packaging technology develop towards more advanced high-density and three-dimensional packaging. , which puts forward higher requirements for electronic packaging substrate materials. In addition to high enough bending strength and excellent dielectric properties, higher-density integrated circuits have more precise requirements for the thermal expansion coeff...

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide a magnesium-aluminum-silicon-based microcrystal with low thermal expansion coefficient for the problems of high sintering temperature, large thermal expansion coefficient, low bending strength, high dielectric constant, and high dielectric loss in existing ceramic materials in the background technology. The glass material and its preparation method, the electronic package substrate made of the material not only has a low coefficient of thermal expansion, but also has high bending strength, good dielectric properties, simple production process, high stability and low cost

Images