Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Etching device for machining

An etching device and machining technology, applied in the field of machinery, can solve the problems of inability to adjust the height of the device, reduce the production and processing efficiency, affect the placement of materials, etc., and achieve the effects of good placement and collection, convenient replacement, and improved efficiency.

Inactive Publication Date: 2018-09-25
ZHENGZHOU YUNQI IND EQUIP TECH CO LTD
View PDF1 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the deficiencies of the prior art, the present invention provides an etching device for mechanical processing, which solves the inconvenience of replacing the nozzle, and at the same time, it is inconvenient to remove debris and impurities remaining in the housing, and it is impossible to repair the device. Adjusting the height will affect the staff to place materials into the shell, which will lead to the problem of reduced production and processing efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Etching device for machining
  • Etching device for machining
  • Etching device for machining

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] Such as Figure 1-4 As shown, the present invention provides a technical solution: an etching device for mechanical processing, including a housing 1, by setting the housing 1, the material can be better etched by the housing 1, the bottom of the housing 1 It is tapered, and the etchant can be better discharged by using the drain pipe 35. There are two bearings 2 clamped on the front and back of the housing 1, and the four bearings 2 are respectively lo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an etching device for machining. The device includes a shell. Two bearings are engaged on the front and the back of the casing respectively, and the four bearings are respectively located on the left and right sides of the front and the back of the shell. The left two bearings and the right two bearings sleeve two rotating shafts respectively. The surfaces of the rotating shafts are fixedly connected to idler wheels. The two idler wheels are in transmission connection through a conveyer mesh belt. A position, of the surface of the left rotating shaft, in the front sideof the corresponding idler wheel is fixedly connected to a driven wheel. Through arrangement of the conveyer mesh belt, a belt, a motor, a cover plate, a liquid conveying pump, nozzles and electric push rods in the device, the nozzles can be replaced conveniently, fragment impurities on a filtration plate in the shell can be conveniently removed through a decontamination port and the height of theshell can be adjusted, and therefore, material placement by operators is not influenced, and the production and machining efficiency can be increased.

Description

technical field [0001] The invention relates to the field of mechanical technology, in particular to an etching device for mechanical processing. Background technique [0002] Etching is the technique of removing material using chemical reaction or physical impact. Etching techniques can be classified into wet etching and dry etching. Usually refers to etching, also known as photochemical etching, which refers to removing the protective film of the area to be etched after exposure plate making and development, and contacting chemical solution during etching to achieve the effect of dissolution and corrosion, forming the effect of concave-convex or hollow molding. [0003] In the process of mechanical processing, etching is one of the important processes. The existing metal etching technology usually uses chemically corrosive potions to form various patterns on the surface of different metal products, such as sand pattern, laser pattern, wood pattern, etc. Patterns such as ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/08
CPCC23F1/08
Inventor 刘艳
Owner ZHENGZHOU YUNQI IND EQUIP TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products