Circuit board partition block seamless laser processing method for thick gas electron multiplier

Abstract

The invention discloses a circuit board partition block seamless laser processing method for a thick gas electron multiplier. The method comprises steps that 1), rough shape cutting is carried out according to design requirements to acquire an original plate; 2) a positioning hole is drilled in the original plate acquired through rough shape cutting in the step 1); 3) the original plate after treatment in the step 1) is covered with a dry film layer, and the dry film layer is exposed and developed; 4) the original plate after treatment in step 3) is subjected to copper window etching, and a dry film is removed; 5) laser drilling on the original plate after treatment in the step 4) is carried out; 6), an outer layer line is prepared on the original plate after treatment in the step 5), andacid etching is carried out; and 7), gold plating on the surface of the original plate after treatment in the step 6) is carried out. The method is advantaged in that product quality is improved, compatibility is improved, and production difficulty is reduced.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board for a thick gas electron multiplier, in particular to a segmented block seamless laser processing method for a circuit board for a thick gas electron multiplier. Background technique [0002] Thick GEM, Thick gaseous electron multiplier (Thick gaseous electron multiplier, THGEM) is a new structure gas detector developed on the basis of traditional GEM. The basic structure of the GEM detector is: an array of tiny holes is made on an insulating plate covered with a thin conductive metal layer on the upper and lower surfaces. Due to the existence of the microporous structure, when a certain voltage difference is applied to the electrodes on the upper and lower planes, a strong electric field can be formed in the hole. When the microporous structure is in a specific working gas, if ionized electrons appear around the pores, the electron avalanche multiplication process can occur in the wo...

AI Technical Summary

Problems solved by technology

This process needs to be combined with a laser lithography system with high positioning accuracy, the cost is high, and its rim can also reach 100μm

The fourth such as figure 1 As shown in middle d, no protective film is covered, and the entire plate is directly etched after mechanical drilling, so that the thickness of the copper layer will decrease with the increase of the rim size, and the control is relatively difficult

Too thin board or too soft board will have large board size expansion and contraction, and the precision is difficult to control, especially after multiple processes, the concentricity of the insulating ring and the through hole will drop significantly

However, if the plate is too thick, the laser processing energy needs to be increased. For the double positioning processing mode, if the laser energy is too large, the insulating ring will not be etched clean, and even the hole wall will be severely carbonized, which will affect the yield of the product.

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