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High capacitance density capacitor comprising series structure dielectric and preparation method thereof

A capacitance density and capacitor technology, applied in the field of capacitors, can solve the problems of high thickness preparation process, high production cost, and low yield rate, and achieve the effects of reducing production process requirements, improving yield rate, and high capacitance density

Active Publication Date: 2018-07-13
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the reduction of thickness requires high preparation technology, high production cost, many defects, and low yield

Method used

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  • High capacitance density capacitor comprising series structure dielectric and preparation method thereof
  • High capacitance density capacitor comprising series structure dielectric and preparation method thereof
  • High capacitance density capacitor comprising series structure dielectric and preparation method thereof

Examples

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Embodiment 2

[0090] This embodiment provides a capacitor, and the capacitor includes a dielectric composed of a positive dielectric material and a negative dielectric material connected in series.

[0091] The dielectric constant of the positive dielectric material is a positive value, which is a polymer-based composite material comprising 4.5wt% carbon nanotubes and 95.5wt% epoxy resin;

[0092] The dielectric constant of the negative dielectric material is a negative value, which is a polymer-based composite material comprising 16wt% carbon nanotubes and 84wt% epoxy resin;

[0093] Both electrodes of the capacitor are copper foils.

[0094] Preparation:

[0095] (1) Weigh 0.5g of carbon nanotubes, 10g of epoxy resin Epon828, 0.5g of dicyandiamide, 5g of N,N-dimethylformamide, 0.1g of 2-methylimidazole, and 10g of butanone at a speed of 1000rpm Ball milled for 12 hours to obtain a positive dielectric material precursor slurry, and then use a coater to coat the slurry on a copper foil wi...

Embodiment 3

[0101] This embodiment provides a capacitor, and the capacitor includes a dielectric composed of a positive dielectric material and a negative dielectric material connected in series.

[0102] The dielectric constant of the positive dielectric material is a positive value, which is a polymer matrix composite material comprising 65wt% barium titanate ceramic particles and 35wt% epoxy resin;

[0103]The dielectric constant of the negative dielectric material is a negative value, and it is a polymer matrix composite material comprising 59wt% silver particles and 41wt% epoxy resin;

[0104] Both electrodes of the capacitor are copper foils.

[0105] Preparation:

[0106] (1) Weigh 20g of barium titanate, 10g of epoxy resin Epon828, 0.5g of dicyandiamide, 5g of N,N-dimethylformamide, 0.1g of 2-methylimidazole, 10g of butanone, and ball mill at a speed of 1000rpm 12h, obtain the positive dielectric material precursor slurry, and then use a coating machine to coat the slurry on a c...

Embodiment 4

[0112] This embodiment provides a capacitor, and the capacitor includes a dielectric composed of a positive dielectric material and a negative dielectric material connected in series.

[0113] The dielectric constant of the positive dielectric material is a positive value, which is a polymer matrix composite material of 32wt% silver particles and 68wt% epoxy resin;

[0114] The dielectric constant of the negative dielectric material is a negative value, which is a polymer-based composite material comprising 4.5wt% graphene and 95.5wt% epoxy resin;

[0115] Both electrodes of the capacitor are copper foils.

[0116] Preparation:

[0117] (1) Weigh 5g of silver particles, 10g of epoxy resin Epon828, 0.5g of dicyandiamide, 5g of N,N-dimethylformamide, 0.1g of 2-methylimidazole, 10g of methyl ethyl ketone, and ball mill at 1000rpm for 12h , to obtain a positive dielectric material precursor slurry, and then use a coater to coat the slurry on a copper foil with a thickness of 35 ...

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Abstract

The invention discloses a high capacitance density capacitor comprising serial structure dielectric and a preparation method thereof. The capacitor provided by the invention comprises the series structure dielectric. The dielectric is composed of a positive dielectric material and a negative dielectric material which are connected in series. The positive dielectric material is the material of which dielectric constant is a positive value. The negative dielectric material is the material of which dielectric constant is a negative value. The preparation method of the capacitor may comprises thesteps of preparing an electrode of which one side loads positive dielectric material precursor film and the electrode of which one side loads negative dielectric material precursor film, and carryingout combination and solidification to obtain the capacitor. The method also may comprise the steps of preparing the electrode of which one side loads the positive (or negative) dielectric material precursor film, loading the negative (positive) dielectric material precursor film, combining the electrode with another electrode, and carrying out solidification to obtain the capacitor. According to the capacitor and the preparation method, the dielectric is thin, the thickness is about 2mum-100mum, the production technology demands and production cost are reduced, and the capacitor density is high and is 1.5nF / cm<2>-50nF / cm<2>.

Description

technical field [0001] The invention belongs to the technical field of capacitors, and relates to a capacitor with high capacitance density and a preparation method thereof, in particular to a capacitor with high capacitance density including a serial structure dielectric and a preparation method thereof. Background technique [0002] With the advancement of electronic information technology, printed circuit boards are developing towards multi-function and miniaturization, requiring more and more electronic components to be embedded in the substrate, which can not only save space, improve production efficiency, but also improve product performance. . In particular, with the development of science and technology, the amount of composite dielectric materials used in the substrate is increasing, and the requirements are getting higher and higher. The dielectric materials currently used to prepare capacitors are mainly composed of positive dielectric materials. Due to the high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/38H01G13/00
CPCH01G4/38H01G13/00
Inventor 罗遂斌于淑会孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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