Brightening agent for composite copper plating

A brightener and composite plating technology, which is applied in the field of electroplating additives, can solve the problems of non-dense grain composition of the copper plating layer, rough crystallization of the plating layer, and poor dispersion ability, so as to speed up the formation of crystal nuclei, improve the chelation performance, reduce the pinhole effect

Active Publication Date: 2018-07-10
连云港市赣榆金成镍业有限公司
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Problems solved by technology

[0005] The technical problem to be solved by the present invention: aiming at the problem that the crystal grain composition of the copper plating layer is not dense after the use of the current brightener for copper plating, and the dispersion ability is poor, the crystallization of the plating layer is rough, and pinhole pitting is easy to occur, the present invention provides

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  • Brightening agent for composite copper plating

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preparation example Construction

[0023] The preparation method of main agent comprises the steps:

[0024] (1) In terms of parts by weight, take 70-80 parts of ethanol solution, 40-50 parts of n-hexane, 30-35 parts of maleic anhydride, 20-25 parts of acrylic acid, 13-18 parts of sodium valproate, 9-16 parts 1 part of vinylphosphonic acid, 2 to 7 parts of ammonium persulfate solution, 1 to 3 parts of catalyst;

[0025] (2) First put the ethanol solution, maleic anhydride, and acrylic acid into the reaction kettle, use nitrogen protection, preheat at 70-75°C for 30 minutes, then add ammonium persulfate solution, raise the temperature to 90-95°C, and stir for 4 hours. Raise the temperature to 160-180°C, then add sodium valproate, vinylphosphonic acid and catalyst, and keep warm for 12-15 hours;

[0026] (3) After the heat preservation is completed, cool to room temperature, discharge the material, collect the discharged material, distill under reduced pressure to recover ethanol and n-hexane, collect the residu...

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Abstract

The invention relates to a brightening agent for composite copper plating and belongs to the technical field of electroplating additives. According to the brightening agent, firstly, maleic anhydrideand acrylic acid are used as raw materials; under the action of ammonium persulfate, polymerization is carried out to form a copolymer; in a polymerization process, sodium valproate and vinylphosphonic acid are added, and are grafted into the copolymer under the catalysis effect of strong acidic styrene cation exchange resin; then N,N-dimethylformamide, anisole, glycidyl methacrylate and the likeare used as raw materials to carry out polymerization; two polymers have good dispersion performance, and copper ions can be uniformly dispersed on the surface of a matrix to carry out copper plating;added benzalacetone and salicylaldehyde can slow down the growth speed of a crystal, a crystal nucleus formation speed is improved and the compactness of crystal grains of a copper plated layer is improved; a surfactant is added and the generation of needle holes is reduced under the action of an auxiliary agent; meanwhile, the binding performance of the plated layer and the matrix is reinforcedby utilizing the effect of the auxiliary agent.

Description

technical field [0001] The invention relates to a brightener for composite copper plating, belonging to the technical field of electroplating additives. Background technique [0002] The acidic copper plating process is suitable for the intermediate coating of the protective decorative electroplating layer, used for electroplating various lighting, hardware tools and daily necessities, and also widely used in plastic electroplating, printed circuit board electroplating and electroforming and other fields. Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is a process of using electrolysis to attach a layer of metal film to the surface of metal or other material parts to prevent metal oxidation. Improve wear resistance, conductivity, reflectivity, corrosion resistance. In the copper electroplating process, copper plating with brightener is used as a thickened bright coating...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 汪逸凡施衍
Owner 连云港市赣榆金成镍业有限公司
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