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A kind of phosphorus-containing active ester and its halogen-free composition and copper clad substrate

A technology of active ester and resin composition, applied in the fields of prepreg, phosphorus-containing active ester and its halogen-free resin composition, laminate and printed circuit board, can solve the problem of poor dielectric properties, affect the performance of the sheet, It can reduce the dielectric loss factor, improve the electrical properties of the system, and meet the effect of halogen-free flame retardant.

Active Publication Date: 2021-02-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical applications, it is found that DOPO compounds have a large water absorption rate, poor dielectric properties and poor heat and humidity resistance of the board.
The additive type is mainly phosphazene and phosphonate compounds, and the flame retardant efficiency of the additive type flame retardant is low, and more amount needs to be added to meet the flame retardant requirements
At the same time, because of its low melting point (generally lower than 150°C), it is easy to migrate to the surface of the board during the processing of the laminate, affecting the performance of the board.

Method used

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  • A kind of phosphorus-containing active ester and its halogen-free composition and copper clad substrate
  • A kind of phosphorus-containing active ester and its halogen-free composition and copper clad substrate
  • A kind of phosphorus-containing active ester and its halogen-free composition and copper clad substrate

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0048] Heat 0.3mol DOPO to 160°C to melt, add 0.1mol 4,4'-dihydroxybenzophenone to the molten DOPO, water will be generated during the reaction, and the generated water will be evaporated under reduced pressure to promote the forward movement of the reaction . After reacting for 4 hours, the temperature was lowered to 100°C, and 100ml of toluene was added. The excess DOPO was dissolved in toluene, and the product was precipitated as a white powder. The product was filtered and purified by washing with tetrahydrofuran to obtain 2DOPO-2PhOH.

[0049] Add 628.5g (1mol) 2DOPO-2PhOH and 816g methyl isobutyl ketone (MIBK) in the flask that thermometer, dropping funnel, condensing tube, fractionating tube, stirrer are installed, nitrogen replacement under reduced pressure in the system, make It dissolves. Then, 182.7g (0.9mol) of terephthaloyl chloride was put into the reaction for 2h, and the temperature in the system was controlled below 60°C; then, 114g (1.2mol) of phenol was add...

Synthetic example 2

[0051] Heat 0.3mol DOPO to 160°C to melt, add 0.1mol 4,4'-dihydroxybenzophenone to the molten DOPO, water will be generated during the reaction, and the generated water will be evaporated under reduced pressure to promote the forward movement of the reaction . After reacting for 4 hours, the temperature was lowered to 100°C, and 100ml of toluene was added. The excess DOPO was dissolved in toluene, and the product was precipitated as a white powder. The product was filtered and purified by washing with tetrahydrofuran to obtain 2DOPO-2PhOH.

[0052] Add 628.5g (1mol) 2DOPO-2PhOH and 816g methyl isobutyl ketone (MIBK) in the flask that thermometer, dropping funnel, condensing tube, fractionating tube, stirrer are installed, nitrogen replacement under reduced pressure in the system, make It dissolves. Then, 182.7g (0.9mol) of terephthaloyl chloride was put into the reaction for 2 hours, and the temperature in the system was controlled below 60°C; then, 172.8g (1.2mol) of naphtho...

Embodiment 1

[0065] Take a container, add 60 parts by weight of 627, add an equivalent amount of A1 active ester and continue to stir, add an appropriate amount of curing accelerator 4-dimethylaminopyridine, continue to stir evenly, and finally adjust the liquid solid content to 60% to 80% with a solvent And make glue. Soak the above glue with glass fiber cloth to form the glue. Immerse the above glue with glass fiber cloth and control it to an appropriate thickness, then dry to remove the solvent to obtain a prepreg. Using several prepared prepregs to stack each other, press a piece of copper foil on both sides, put them into a hot press and cure them to form the epoxy resin copper-clad laminate. The physical data are shown in Table 1.

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Abstract

The invention provides a phosphorus-containing active ester and its halogen-free resin composition, as well as a prepreg and a laminate using the same. The halogen-free resin composition comprises: (A) thermosetting resin; (B) phosphorus-containing active ester resin. Prepregs and laminates made of the halogen-free resin composition have low dielectric loss factor and can realize halogen-free flame retardancy.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a phosphorus-containing active ester and a halogen-free resin composition thereof, as well as prepregs, laminates and printed circuit boards using the same. Background technique [0002] With the development of electronic components in the direction of small, light, thin, high performance, and multifunctional, it brings high frequency and high speed signal transmission. This requires that the dielectric constant and dielectric loss of electronic materials are relatively low, which are related to the structure of the material, and low dielectric constant and low dielectric loss resins generally have in structure: large free volume, low polarizability , Low water absorption, low dielectric constant structure and so on. In addition, on July 1, 2006, the EU's two environmental protection directives "Directive on Waste Electrical and Electronic Equipment" an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K5/5313C08K7/14C08K3/36C08J5/24C07F9/6574B32B17/02B32B17/06B32B27/04B32B27/38B32B15/00B32B15/14H05K1/03
CPCH05K1/0353C07F9/657172C08K3/36C08K5/5313C08K7/14B32B5/02B32B15/00B32B15/14B32B2262/101B32B2260/046B32B2260/021C08J2363/00C08L2201/02C08J5/244C08J5/249C08L63/00B32B17/02B32B17/06B32B27/04B32B27/38C07F9/6574H05K1/03
Inventor 曾宪平徐浩晟何烈相
Owner GUANGDONG SHENGYI SCI TECH
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