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A halogen-free high-activity low-spatter solder wire flux and preparation method thereof

A high-activity, solder wire technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of large spatter and insufficient activity, achieve less spatter, strong ability to remove oxides, and reduce surface tension.

Inactive Publication Date: 2016-03-02
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a novel halogen-free high-activity low-splash flux for lead-free solder wire and its preparation method for the above-mentioned problems such as insufficient activity of the halogen-free flux for solder wire and large spatter, so as to ensure The solderability of halogen-free flux can meet the comprehensive requirements of modern electronics industry for tin wire flux

Method used

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  • A halogen-free high-activity low-spatter solder wire flux and preparation method thereof
  • A halogen-free high-activity low-spatter solder wire flux and preparation method thereof
  • A halogen-free high-activity low-spatter solder wire flux and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] The flux for the halogen-free high-activity low-spatter solder wire of this embodiment has the following components and mass percentages:

[0031]

[0032]

[0033] Specific preparation method:

[0034] Add 39.92% rosin 150, 39.92% polymerized rosin 115 and 9% hydrogenated abietyl alcohol into the container, heat to 140°C and stir until completely melted. At this temperature, add 2% adipic acid and 2% sebacic acid, 1.6% halogen-free activity enhancer ST-400, 0.45% periodate D2, 0.11% fluorocarbon surfactant FSN-100 , 5% high-boiling-point organic solvent triethylene glycol butyl ether, continue to stir for 20 minutes until all components are completely dissolved, and then the halogen-free high-activity low-spatter solder wire flux can be made.

[0035] The expansion rate, surface insulation resistance after welding, and welding tests were respectively carried out on this embodiment, and the test results are shown in Table 1 below.

Embodiment 2

[0037] The flux for the halogen-free high-activity low-spatter solder wire of this embodiment has the following components and mass percentages:

[0038]

[0039] Specific preparation method:

[0040] Add 27.66% Brazilian rosin, 55.32% 125 rosin and 3% hydrogenated rosin methyl ester into the container, heat to 140°C and stir until completely melted. At this temperature, add 2.5% hexadecanic acid, 1.5% sebacic acid and 1.5% dodecanoic acid, 1.8% halogen-free activity enhancer ST-400, 0.54% highly active iodate D2, 0.18% fluorocarbon Surfactant FC-4430, 6% high-boiling point organic solvent diethylene glycol monobutyl ether, continue to stir for 30 minutes until all components are completely dissolved, and then you can make halogen-free high-activity low-spatter solder wire flux.

[0041] The expansion rate, surface insulation resistance after welding, and welding tests were carried out on the examples respectively, and the test results are shown in Table 1 below.

Embodiment 3

[0043] The flux for the halogen-free high-activity low-spatter solder wire of this embodiment has the following components and mass percentages:

[0044]

[0045]

[0046] Specific preparation method:

[0047] Add 64.17% water white rosin, 21.39% 685 rosin and 2% pentaerythritol tetrabenzoate into the container, heat to 140°C and stir until completely melted. At this temperature, add 1.5% adipic acid, 3% sebacic acid and 1.5% myristic acid, 1.2% halogen-free activity enhancer ST-400, 0.58% highly active iodate D2, and 0.16% fluorocarbon Surfactant FSO-100, 6% high-boiling point organic solvent 2-ethyl-1,3-hexanediol, continue to stir for 25 minutes until all components are completely dissolved, and then you can make halogen-free high-activity low-splash solder wire flux.

[0048] The expansion rate, surface insulation resistance after welding, and welding tests were respectively carried out on this embodiment, and the test results are shown in Table 1 below.

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Abstract

The invention discloses halogen-free high-activity low-splatter solder wire soldering flux and a preparing method thereof. The halogen-free high-activity low-splatter solder wire soldering flux comprises, by mass, 2-10 percent of alcohol or alcohol ether high-boiling-point solvent, 0.08-1.5 percent of high-activity iodate, 2-10 percent of compound binary organic acid, 0.5-5 percent of halogen-free activity enhancer, 2-15 percent of viscosity modifier, 0.04-0.2 percent of efficient surface active agent and the balance modified rosin and rosin derivatives. The preparing method includes the steps that the compound rosin and the viscosity modifier are added into a container to be heated and stirred until the compound rosin and the viscosity modifier are completely melted down, the organic acid, the novel high-activity iodate, the efficient surface active agent and the high-boiling-point solvent are added to be stirred continuously, and therefore the soldering flux is prepared. The prepared halogen-free soldering flux for solder wires is free of halogen compounds, tin is easy to apply in the soldering process, splatter is little, smells are light, soldering spots are bright and full, damage to the health and the environment is avoided, and the post-soldering reliability effect of an electronic product is ensured.

Description

technical field [0001] The present invention relates to a solder wire flux, in particular to a novel halogen-free high-activity low-splash solder wire flux and a preparation method thereof, which is a novel halogen-free flux for lead-free solder wire and is used for electronic and electrical products. Soldering. Background technique [0002] In recent years, due to the increasing awareness of human environmental protection and the successive promulgation of lead prohibition laws, electronic packaging soft soldering materials have gradually transitioned from traditional lead-containing solder alloys to lead-free solders, among which Sn-Cu series and Sn-Ag- Cu-based solder is recognized in the industry as a better and commercialized lead-free solder, which has the characteristics of high melting point and easy oxidation. The tin wire flux currently used basically follows the original flux system. The active agents used in traditional solder wire are mainly halogen-containing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362
CPCB23K35/3612B23K35/40
Inventor 黄永灿邓延程江陆雁杜昆
Owner SOUTH CHINA UNIV OF TECH
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