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A kind of phenoxycyclotriphosphazene active ester, halogen-free resin composition and its application

A technology of resin composition and phenoxy ring, which is applied in the field of phenoxycyclotriphosphazene active ester and halogen-free resin composition, can solve problems such as bad smell, influence of dielectric loss angle, and large amount of smoke. Achieve the effect of improving the electrical properties of the system and satisfying the effect of halogen-free flame retardant

Inactive Publication Date: 2018-01-30
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] With the rapid development of electronic technology, people are increasingly seeking environmental protection, but traditional high-frequency and high-speed materials basically use halides, antimonides, etc. to achieve the purpose of flame retardancy. Not only does it generate a lot of smoke and smell bad, but it also emits highly toxic and corrosive hydrogen halide gas, which not only pollutes the environment, but also endangers human health; at present, the environmental protection compounds corresponding to phosphorus-containing and phenanthrene-type compounds DOPO or ODOPB are widely used in industry. Oxygen resin is used to realize ordinary FR-4 to achieve flame retardancy, but phosphorus-containing phenanthrene-type compounds DOPO or ODOPB still have a large water absorption rate, which has a great influence on the dielectric constant and dielectric loss tangent of high-frequency and high-speed materials

Method used

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  • A kind of phenoxycyclotriphosphazene active ester, halogen-free resin composition and its application
  • A kind of phenoxycyclotriphosphazene active ester, halogen-free resin composition and its application
  • A kind of phenoxycyclotriphosphazene active ester, halogen-free resin composition and its application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Add the solvent, phenoxycyclotriphosphazene containing hydroxyl groups (the proportion of which contains 2 hydroxyl groups is greater than 65%), acid-binding agent and catalyst into the reaction device, stir, pass through nitrogen protection, and gradually drop a certain amount at low temperature For p-benzoyl chloride, after reacting for 1-8 hours, add an appropriate amount of phenol, continue to react for 1-8 hours, cool to room temperature, filter with suction, distill the filtrate under pressure, and evaporate the solvent to obtain a viscous product.

[0053] After dissolving 30g of the above product in an organic solvent, add 70g of DCPD epoxy resin (the selected DCPD epoxy resin is HP-7200H (DIC), equivalent weight 275-280), an appropriate amount of imidazole and pyridine, stir and mix evenly to obtain a glue.

[0054] Select 300×300cm E-glass fiber cloth with smooth and flat surface, evenly coat the above glue, and bake it in an oven at 155°C for 7 minutes to make...

Embodiment 2

[0057] Add the solvent, phenoxycyclotriphosphazene containing hydroxyl groups (the proportion of which contains 2 hydroxyl groups is greater than 65%), acid-binding agent and catalyst into the reaction device, stir, pass through nitrogen protection, and gradually drop a certain amount at low temperature For p-benzoyl chloride, after reacting for 1-8 hours, add an appropriate amount of phenol, continue to react for 1-8 hours, cool to room temperature, filter with suction, distill the filtrate under pressure, and evaporate the solvent to obtain a viscous product.

[0058] After taking 30g of the above product and dissolving it in an organic solvent, add 40g of DCPD benzoxazine (the selected DCPD benzoxazine is LZ8260 (Huntsman)), 20g of DCPD epoxy resin (the selected DCPD epoxy resin is HP-7200H (DIC ), equivalent weight 275-280), styrene / maleic anhydride 10g (selected anhydride is EF-30, Sartomer), appropriate amount of imidazole and pyridine, stir and mix evenly to obtain glue....

Embodiment 3

[0062] Add the solvent, phenoxycyclotriphosphazene containing hydroxyl groups (the proportion of which contains 2 hydroxyl groups is greater than 65%), acid-binding agent and catalyst into the reaction device, stir, pass through nitrogen protection, and gradually drop a certain amount at low temperature For p-benzoyl chloride, after reacting for 1-8 hours, add an appropriate amount of phenol, continue to react for 1-8 hours, cool to room temperature, filter with suction, distill the filtrate under pressure, and evaporate the solvent to obtain a viscous product.

[0063] After dissolving 30g of the above product in an organic solvent, add 30g of DCPD cyanate (the selected DCPD cyanate is LONZA-Primaset DT-4000), 20g of 4,4'-diphenylmethane bismaleimide, DCPD ring 20g of epoxy resin (the selected DCPD epoxy resin is HP-7200H (DIC), equivalent weight 275-280), appropriate amount of aluminum acetylacetonate and pyridine, stir and mix evenly to obtain glue.

[0064] Select 300×300c...

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Abstract

The invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and applications thereof. The phenoxycyclotriphosphazene active ester contains at least 65% by molar ratio of substances having the following structural formula. The halogen-free resin composition comprises in parts by weight: 5-50 parts by weight of phenoxycyclotriphosphazene active ester, 15-85 parts by weight of thermosetting resin, 1-35 parts by weight of curing agent, 0-5 parts by weight Parts of curing accelerator and 0-100 parts of inorganic filler. The present invention introduces phenoxycyclotriphosphazene active ester into the thermosetting resin, utilizes the reaction of the active ester with thermosetting resins such as epoxy resins without generating hydroxyl groups, can not only meet the requirements of halogen-free flame retardancy, but also improve the electrical properties of the system (reduce , stable Dk and Df), making it possible for high-frequency high-speed substrate materials to be halogen-free.

Description

technical field [0001] The invention relates to a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The halogen-free resin composition is used for preparing prepregs, laminates and printed circuit boards. Background technique [0002] In recent years, with the development of integration technology, bonding technology and assembly technology of semiconductor devices used in electronic equipment, high-density electronic instrument components and high-density printed circuit board wiring, electronic equipment has been continuously improved, especially in those using There has been a rapid development in broadband electronic equipment such as mobile communication devices. [0003] Printed circuit boards, as a component of such electronic equipment, are developing towards higher levels of multilayer printed circuit boards and more precise wiring. In order to increase the signal transmission speed to the level required to accelerate infor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C07F9/6593C08G59/42C08G73/06C08G73/12C08L63/00C08L79/04C08L79/08C08L71/12C08L57/02
Inventor 何岳山
Owner GUANGDONG SHENGYI SCI TECH
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