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Chip employing liquid metal for enhancing inner heat transmission

A liquid metal and chip technology, applied in semiconductor/solid device components, electrical components, electrical solid devices, etc., can solve the problems of large thermal resistance, narrow heat transfer path of chips, etc., and achieve high-efficiency heat dissipation and less heat transfer Thermal resistance, the effect of enhancing heat dissipation performance

Inactive Publication Date: 2018-06-29
XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Purpose of the present invention: solve the problem of narrow heat transfer path and large thermal resistance inside the chip, and improve the heat dissipation performance of the chip

Method used

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  • Chip employing liquid metal for enhancing inner heat transmission
  • Chip employing liquid metal for enhancing inner heat transmission
  • Chip employing liquid metal for enhancing inner heat transmission

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Experimental program
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Effect test

Embodiment Construction

[0019] Nitrogen 9 is poured into the cavity of the traditional ceramic chip package, and the heat dissipation effect is very poor. The heat generated by the silicon chip is mainly transmitted to the sealing ring 2 through the substrate, and then to the cover through the very small contact area between the sealing ring 2 and the cover plate 1. 1 is lost to the outside world, the heat transfer path of the chip is narrow, the thermal resistance is large, and the heat dissipation performance is poor.

[0020] The present invention fills the cavity of the ceramic chip with the liquid metal 7, increases the heat transfer path, reduces the internal thermal resistance of the chip, and improves the heat dissipation performance of the chip.

[0021] Common liquid metals such as mercury, but due to its toxicity, cannot be selected in the chip, due to the liquid gallium metal 7 alloy, which has high thermal conductivity and low melting point. For example, GaIn15Sn13Zn1 has a low melting p...

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Abstract

The invention provides a chip employing liquid metal for enhancing inner heat transmission. Along with constant improvement of chip performance, power consumption of a ceramic chip increases continuously. Especially along with emergence of packaging forms of three-dimensional stacking and SIP energy, chip packaging density increases continuously and heat flow density increases therewith. The heatdissipation problem of the chip itself becomes urgent. At the same time, the chip is filled with nitrogen (9) due to problems of sealing performance and the like of the ceramic chip. However, the nitrogen (9) has extremely low thermal conductivity and the heat dissipation path of the chip is limited. According to the invention, the chip package is filled with liquid metal (7), so that the transmission path is enhanced, chip heat resistance is reduced and chip heat dissipation performance is improved.

Description

technical field [0001] The invention belongs to the field of chip design, and in particular relates to a chip in which liquid metal enhances internal heat transfer. Background technique [0002] With the continuous improvement of chip performance, the power consumption of ceramic chips continues to increase, especially with the emergence of three-dimensional stacking and SIP packaging, the chip packaging density continues to increase, and the heat flux density increases accordingly. The heat dissipation problem of the chip itself is very serious. . Contents of the invention [0003] The purpose of the present invention is to solve the problems of narrow heat transfer path and large thermal resistance inside the chip, and improve the heat dissipation performance of the chip. [0004] Technical scheme of the present invention: [0005] A liquid metal-enhanced internal heat transfer chip, including a cover 1, a sealing ring 2, a ceramic substrate 3, a silicon chip 4, a bond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/44
CPCH01L2224/48091H01L2224/48227H01L2924/16195H01L2924/00014H01L23/3675H01L23/3736H01L23/44
Inventor 赵亮吴波杨明明焦超锋醋强一张娅妮
Owner XIAN AVIATION COMPUTING TECH RES INST OF AVIATION IND CORP OF CHINA
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