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Production method of resin-based diamond cutting chip for cutting QFN (Quad Flat No-lead Package) substrates

A manufacturing method and cutting blade technology, applied in the direction of manufacturing tools, metal processing equipment, abrasives, etc., can solve the problems of the strength, wear resistance and heat resistance of the cutting blade cannot meet the requirements, and it is difficult to meet the use requirements.

Active Publication Date: 2018-06-22
西安拓为精密工具有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The traditional resin-based diamond cutting sheet is used to cut the QFN packaging substrate. Due to the limitation of raw materials and production process, the strength, wear resistance and heat resistance of the cutting sheet cannot meet the requirements, especially when the thickness is 0.10-0.20mm. Difficult to meet usage requirements

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 1) Preparation of resin-based binder:

[0025] Soak 50% of ultrafine resin powder, 30% of ultrafine inorganic filler and 20% of ultrafine metal powder in the cellulose dispersant solution by weight percentage, stir and mix evenly, and dry at a temperature of 60°C;

[0026] Among them, the ultrafine resin powder adopts phenolic resin with a particle size of 1-5 μm, the ultrafine inorganic filler adopts SiC whiskers with a whisker length of 1-10 μm and a whisker diameter of 0.1-2 μm, and the ultrafine metal powder adopts Cu with a particle size of 1-10 μm. 、CuSn 20 , Ni, Fe.

[0027] 2) Preparation of mixed powder:

[0028] According to the volume ratio of 18.75%, Ni-plated diamond with a particle size of 100 μm is added to the resin-based binder and mixed evenly to obtain a mixed powder;

[0029] 3) Thermoforming:

[0030] Put the mixed powder evenly and evenly in the pressing mold, raise the temperature to 120°C at 8Mpa, hold the pressure for 15 minutes, release the...

Embodiment 2

[0037] 1) Preparation of resin-based binder:

[0038] Soak 50% of ultrafine resin powder, 30% of ultrafine inorganic filler and 20% of ultrafine metal powder in the cellulose dispersant solution by weight percentage, stir and mix evenly, and dry at a temperature of 60°C;

[0039] Among them, the ultrafine resin powder adopts polyimide resin with a particle size of 1-5μm, and the ultrafine inorganic filler adopts Al with a whisker length of 1-10μm and a whisker diameter of 0.1-2μm. 2 o 3 Whiskers, Cu, CuSn with a particle size of 1-10μm are used for ultra-fine metal powder 20 , Ni, Fe.

[0040] 2) Preparation of mixed powder:

[0041] Add Ni-plated diamond with a particle size of 50 μm into the resin-based binder at a volume ratio of 25% and mix evenly to obtain a mixed powder;

[0042] 3) Thermoforming:

[0043] Put the mixed powder evenly and evenly in the pressing mold, raise the temperature to 150°C at 10Mpa, hold the pressure for 20 minutes, release the air to reduce ...

Embodiment 3

[0050] 1) Preparation of resin-based binder:

[0051] Soak 50% of ultrafine resin powder, 30% of ultrafine inorganic filler and 20% of ultrafine metal powder in the cellulose dispersant solution by weight percentage, stir and mix evenly, and dry at a temperature of 60°C;

[0052] The ultrafine resin powder adopts Dialok939P resin with a particle size of 1-5μm; 1-10μm Cu, CuSn 20 , Ni, Fe.

[0053] 2) Preparation of mixed powder:

[0054] Add Ni-plated diamond with a particle size of 120 μm into the resin-based binder at a volume ratio of 25% and mix evenly to obtain a mixed powder;

[0055] 3) Thermoforming:

[0056] Put the mixed powder evenly and evenly in the pressing mold, raise the temperature to 150°C at 10Mpa, hold the pressure for 30 minutes, release the air to reduce the pressure to 0, then increase the pressure to 10Mpa and heat up to 240°C for 30 minutes, and finally unload Air cooling to obtain a cutting sheet blank with a thickness of 0.30mm;

[0057] 4) Curin...

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Abstract

The invention provides a production method of resin-based diamond cutting chip for cutting QFN (Quad Flat No-lead Package) substrates. The resin-based cutting chip is produced by combining superfine resin powder, a superfine inorganic filler, superfine metal powder and Ni-plated diamond according to a certain ratio, wherein the content of the superfine resin powder is 50wt%; the content of the superfine inorganic filler is 30wt%; the content of the superfine metal powder is 20wt%; the content of the diamond is 18.75-58vol%. The production method of the resin-based diamond cutting chip comprises the following steps: firstly proportioning the powder and then uniformly mixing the powder by using a hot-press forming device, then pressing the mixture into a cutting chip blank under certain hot-press forming process conditions, curing the cutting chip blank under certain curing process conditions and finally precisely grinding and machining the cured cutting chip blank to obtain the resin-based diamond cutting chip which meets the required specification and has thickness of 0.10-0.20mm. Through the production method of resin-based diamond cutting chip for cutting QFN substrates, the strength, the rigidity, the heat resistance and the abrasion resistance of the cutting chip can be effectively improved; the service life of the cutting chip can be effectively prolonged; compared with cutting chips produced by conventional components and processes for cutting the QFN substrates with the thickness of 0.7-1.1mm, the service life of the cutting chip is prolonged by 100-120%.

Description

technical field [0001] The invention belongs to the field of abrasive tool manufacturing, and relates to a method for manufacturing a diamond cutting sheet, in particular to a method for manufacturing a resin-based diamond cutting sheet for cutting QFN substrates with a thickness of 0.10-0.20 mm. Background technique [0002] QFN package (Quad Flat No-lead Package) is a new type of package that has just been developed in recent years. It has the characteristics of small size, low impedance and self-inductance, and good electrical and thermal properties. The QFN package substrate is composed of two materials with different hardness and brittleness, that is, a copper lead frame with a thickness of about 0.2 mm and a lower hardness copper lead frame (a layer of Ni is plated on the copper surface) and a layer of about 0.2 mm thick. 0.8mm brittle, high hardness BT resin (added with Si or Si 2 o 3 and other micropowders). Among them, the cutting and forming process is an import...

Claims

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Application Information

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IPC IPC(8): B24D3/02B24D3/34B24D18/00
CPCB24D3/02B24D3/342B24D18/00B24D18/0009
Inventor 唐鹏国周勇赵宁林思聪赵博
Owner 西安拓为精密工具有限公司
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