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Total-synthesis water-based cutting fluid for sapphire and preparation method of cutting fluid

A sapphire and cutting fluid technology, applied in the petroleum industry, lubricating compositions, etc., can solve the problems of insufficient wetting penetration, pungent odor, dry cutting wear, etc., achieve good sedimentation effect, improve wetting penetration, and lubricate extremely Pressure boosting effect

Active Publication Date: 2018-06-15
TIANJIN RES INST FOR ADVANCED EQUIP TSINGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, oil-based products have some defects as cutting fluids: first, there is a large oil mist on site, with a certain pungent smell, and long-term exposure is harmful to the health of workers; second, there are certain safety hazards when oil products encounter open flames; Discharge treatment is difficult, and there are many sulfides in the oil sludge, which affects the environment
Contains no wetting agent, which may cause dry cutting wear due to insufficient wetting and penetration when cutting at high depths of cut

Method used

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  • Total-synthesis water-based cutting fluid for sapphire and preparation method of cutting fluid
  • Total-synthesis water-based cutting fluid for sapphire and preparation method of cutting fluid
  • Total-synthesis water-based cutting fluid for sapphire and preparation method of cutting fluid

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A kind of fully synthetic water-based sapphire cutting fluid, its preparation method comprises the following steps:

[0040] (1) Weigh 10% trans polyether, 6% polyethylene glycol 600, 5% organic trivalent polycarboxylic acid, 5% borate, 1% phosphoric acid ester, 2% water-soluble DPZ, 0.25% modified cationic polyether, 0.25% polyoxyethylene dodecyl dimethyl ammonium bromide, 0.5% alkylisothiazolinone, 1.5% hydroxyethyl hexahydro-s-triazine, 0.5% secondary alcohol polyoxyethylene ether surfactant, 4% isononanoic acid, 3% diglycolamine, 7% triethanolamine, 0.5% silicone defoamer and 53.5% water;

[0041] (2) Put 53.5% of the water weighed in step (1) into the stirred reactor, then add 3% of diglycolamine and 7% of triethanolamine to it, stir until evenly mixed, then add 5% of Organic ternary polycarboxylic acid, 5% borate, heated to 60°C in a water bath and kept stirring until the solution in the kettle was transparent and uniform, then stopped heating;

[0042] (3) Add ...

Embodiment 2

[0044] A kind of fully synthetic water-based sapphire cutting fluid, its preparation method comprises the following steps:

[0045] (1) Weigh 12% of modified polyalkylene glycol, 6% of polyethylene glycol 600, 2% of sebacic acid, 8% of boric acid ester, 2% of phosphoric acid ester, 2% of water soluble Organic molybdenum, 0.5% modified cationic polyether, 0.5% polydichloroethyl ether tetramethylethylenediamine, 1% hydroxyethyl hexahydro-s-triazine, 1% iodopropynyl butyl Urethane, 0.8% silicone polyether surfactant, 3% isononanoic acid, 4% ethanolamine and 6% triethanolamine, 0.3% silicone defoamer and 50.9% water;

[0046] (2) Put 50.9% of the water weighed in step (1) into the stirred reactor, then add 4% ethanolamine and 6% triethanolamine therein, stir until the mixture is uniform, then add 2% sebacic acid and 8% boric acid ester, heated in a water bath to 60°C and kept stirring until the solution in the kettle was transparent and uniform, then stopped heating;

[0047] (3...

Embodiment 3

[0049] A kind of fully synthetic water-based sapphire cutting fluid, its preparation method comprises the following steps:

[0050] (1) Weigh 12% of modified polyalkylene glycol, 6% of glycerin, 3% of organic trivalent polycarboxylic acid, 5% of borate, 1% of phosphoric acid ester, 3% of water soluble Organic molybdenum, 0.5% modified cationic polyether, 1% polydichloroethyl ether tetramethylethylenediamine, 2.5% alkylisothiazolinone, 0.5% iodopropynyl alcohol butyl aminomethyl ester, 0.6% silicone polyether surfactant, 5% n-octanoic acid, 3% diethanolamine, 8% triethanolamine, 0.6% silicone defoamer and 48.3% water;

[0051] (2) Put 48.3% of the water weighed in step (1) into the stirred reactor, then add 3% of diethanolamine and 8% of triethanolamine to it, stir until evenly mixed, and then add 3% of organic triethanolamine Polycarboxylate and 5% borate, heated to 60°C in a water bath and kept stirring until the solution in the kettle was transparent and uniform, then stopp...

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Abstract

The invention provides total-synthesis water-based cutting fluid for sapphire and a preparation method of the cutting fluid. The cutting fluid for the sapphire comprises the following components of: in percent by weight, 8-25% of lubricant, 2-10% of rust inhibitor, 2-7% of an extreme-pressure additive, 0.25-2% of a settling agent, 0.5-3% of fungicide, 0.2-0.8% of a wetting agent, 3-5% of a cosolvent, 4-15% of pH stabilizer, 0.2-0.8% of defoamer and the balance water. According to the total-synthesis water-based cutting fluid for the sapphire, the reasonable additives are adopted for compounding, lubricating and wetting permeation performance of the cutting fluid are better than common water-based cutting fluid for sapphire, the total-synthesis water-based cutting fluid for the sapphire canreach the level of oil-based cutting fluid for the sapphire, and meanwhile the defects of poor powder sedimentation, large oil mist, potential risks for open flames, difficult post-processing and thelike of the oil-based product are avoided.

Description

technical field [0001] The invention belongs to the technical field of sapphire crystal cutting and cutting fluid, and in particular relates to a fully synthetic water-based sapphire cutting fluid and a preparation method thereof. Background technique [0002] As an important technical crystal, sapphire crystal is widely used in high-tech fields such as laser, integrated circuit, precision instrument, mechanical automation, military industry and aerospace. To meet these high-precision industry demands, it is becoming more and more important to process high-quality sapphire devices quickly and efficiently. However, due to the high hardness and high strength of sapphire itself, the tool is easy to wear during processing, resulting in reduced processing efficiency and even product chipping. Therefore, sapphire processing has higher requirements for processing fluid than ordinary glass cutting fluid. [0003] Traditional sapphire cutting, especially the cutting of sapphire crys...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02C10N30/06C10N30/12
CPCC10M173/02C10M2207/126C10M2207/127C10M2207/22C10M2209/103C10M2209/104C10M2209/108C10M2215/042C10M2215/222C10M2217/06C10M2219/104C10M2223/04C10M2227/061C10M2227/066C10M2229/02C10M2229/047C10N2030/06C10N2030/12
Inventor 刘金优刘会萍戴媛静张晨辉雒建斌
Owner TIANJIN RES INST FOR ADVANCED EQUIP TSINGHUA UNIV
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