Polyimide film

A polyimide film and film technology, applied in the directions of lamination, printed circuits, electrical components, etc., can solve the problems of uneven coating, wrinkles or twists, and reduced yield, and achieve excellent electrical insulation and performance improvement. Effect

Inactive Publication Date: 2018-05-11
DUPONT TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the polyimide film has a large slack (talumi), there is a problem that wrinkles or zigzags (snakes) occur during processing. On the surface of imide film, it becomes the main cause of uneven coating and lower yield.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0153] Prepare pyromellitic dianhydride (molecular weight 218.12) / 4,4'-diaminodiphenyl ether (molecular weight 200.24) according to the molar ratio of 1:1, in DMAc (N,N-dimethylacetamide ) to prepare a 23.7% by weight solution and perform polymerization to obtain a 4000 poise polyamic acid solution.

[0154] On the other hand, inorganic particles (with a particle diameter ranging from 0.01 μm to 6.0 μm, an average particle diameter of 0.87 μm, and particles with a particle diameter of 0.5 μm to 2.5 μm, 81.5% by volume of phosphoric acid in all particles were obtained. Hydrogen calcium particles) N,N-dimethylacetamide slurry.

[0155] Add the slurry to the polyamic acid solution so that when the polyimide is formed, the calcium hydrogen phosphate is 0.15% by weight per 1 weight of the polyimide resin, and stir at room temperature for 30 minutes to disperse the inorganic particles in the polyimide. amic acid solution.

[0156] A conversion agent containing acetic anhydride (mo...

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Abstract

The present invention relates to and provides a polyimide film which can effectively prevent or inhibit the wrinkle or bending generated when a flexible printed circuit and the like is processed. According to the polyimide film, a plurality of measurement points are selected along a width direction, the slack values of the measurement points at a 2 kg / m load are measured, and the slack differenceof the maximum slack value and the minimum slack value is less than 5 mm.

Description

technical field [0001] The present invention relates to polyimide film and its manufacturing method. Moreover, this invention relates to the flexible metal laminated board provided with this polyimide film and metal foil. Background technique [0002] Flexible printed circuit boards (FPC: Flexible printed circuits) are generally formed using various insulating materials, which are formed by using a flexible insulating film as a substrate and bonding metal foil to the surface of the substrate by heating and pressing. method to manufacture. As the insulating film, a polyimide film excellent in heat resistance and electrical insulation is used. [0003] Under such circumstances, the reality is that there is an increasing demand for improving the performance of polyimide films as electrical insulating supports and for improving processability. [0004] However, when the polyimide film has a large slack (talumi), there is a problem that wrinkles or zigzags (snakes) occur durin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K3/32C08J5/18B32B15/08B32B15/20B32B27/28B32B7/12B32B37/10B32B37/12B32B37/06B32B38/00B32B38/16H05K1/03C08L79/08
CPCB32B7/12B32B15/08B32B15/20B32B27/281B32B37/06B32B37/10B32B37/1284B32B38/0004B32B38/0008B32B38/164B32B2307/734C08G73/1007C08G73/1071C08J5/18C08J7/08C08J2379/08C08K3/32H05K1/0346B29C55/12C08L79/08H05K1/09H05K3/4644H05K2201/0154H05K2201/0355
Inventor 三田村学大场大史
Owner DUPONT TORAY CO LTD
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